JPS5833705Y2 - 吸着固定装置 - Google Patents

吸着固定装置

Info

Publication number
JPS5833705Y2
JPS5833705Y2 JP1980071025U JP7102580U JPS5833705Y2 JP S5833705 Y2 JPS5833705 Y2 JP S5833705Y2 JP 1980071025 U JP1980071025 U JP 1980071025U JP 7102580 U JP7102580 U JP 7102580U JP S5833705 Y2 JPS5833705 Y2 JP S5833705Y2
Authority
JP
Japan
Prior art keywords
suction
outer edge
porosity
layers
adsorption
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980071025U
Other languages
English (en)
Japanese (ja)
Other versions
JPS56172941U (enExample
Inventor
臣二 関家
Original Assignee
株式会社 デイスコ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社 デイスコ filed Critical 株式会社 デイスコ
Priority to JP1980071025U priority Critical patent/JPS5833705Y2/ja
Priority to US06/265,318 priority patent/US4521995A/en
Priority to DE3120477A priority patent/DE3120477C2/de
Publication of JPS56172941U publication Critical patent/JPS56172941U/ja
Application granted granted Critical
Publication of JPS5833705Y2 publication Critical patent/JPS5833705Y2/ja
Priority to US06/708,626 priority patent/US4625463A/en
Expired legal-status Critical Current

Links

Landscapes

  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
JP1980071025U 1980-05-23 1980-05-23 吸着固定装置 Expired JPS5833705Y2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1980071025U JPS5833705Y2 (ja) 1980-05-23 1980-05-23 吸着固定装置
US06/265,318 US4521995A (en) 1980-05-23 1981-05-20 Wafer attracting and fixing device
DE3120477A DE3120477C2 (de) 1980-05-23 1981-05-22 Verfahren und Vorrichtung zum Aufspannen von Halbleiterplättchen
US06/708,626 US4625463A (en) 1980-05-23 1985-03-06 Wafer attracting and fixing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980071025U JPS5833705Y2 (ja) 1980-05-23 1980-05-23 吸着固定装置

Publications (2)

Publication Number Publication Date
JPS56172941U JPS56172941U (enExample) 1981-12-21
JPS5833705Y2 true JPS5833705Y2 (ja) 1983-07-28

Family

ID=29664850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980071025U Expired JPS5833705Y2 (ja) 1980-05-23 1980-05-23 吸着固定装置

Country Status (1)

Country Link
JP (1) JPS5833705Y2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594045A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd 真空吸着固定手段
KR100189970B1 (ko) * 1995-08-07 1999-06-01 윤종용 웨이퍼 연마장치
DE10260233B4 (de) 2002-12-20 2016-05-19 Infineon Technologies Ag Verfahren zum Befestigen eines Werkstücks mit einem Feststoff an einem Werkstückträger und Werkstückträger

Also Published As

Publication number Publication date
JPS56172941U (enExample) 1981-12-21

Similar Documents

Publication Publication Date Title
EP0147094B1 (en) Vacuum suction device
US4521995A (en) Wafer attracting and fixing device
US7163437B1 (en) System with sealed polishing pad
US4519168A (en) Liquid waxless fixturing of microsize wafers
US5645474A (en) Workpiece retaining device and method for producing the same
JPH08330401A (ja) ウエハチャック
US6402594B1 (en) Polishing method for wafer and holding plate
JPH10180599A (ja) 薄板ワーク平面研削装置及び方法
KR20040055681A (ko) 작업피스 처리 방법 및 작업 캐리어
JP2662495B2 (ja) 接着半導体基板の製造方法
JPS6022500B2 (ja) 位置合せ載置方法
JPH11243135A (ja) 真空吸着盤
JPS6040275Y2 (ja) 吸着固定装置
JP4519457B2 (ja) 加工用基板固定装置およびその製造方法
JP2020078832A (ja) ポーラスチャックテーブル及びポーラスチャックテーブルの製造方法
JP2555938Y2 (ja) 真空チャック
JPH0567371B2 (enExample)
JPH04267540A (ja) チャック機構における半導体ウエハの取外し方法
JPH0236066A (ja) 研磨布および研磨装置
KR102037747B1 (ko) 웨이퍼 연마 장치
JP2651354B2 (ja) 真空チャックの吸着板
JPS60238246A (ja) 真空吸着台
JP2000158268A (ja) ユニバ−サルチャック用ウエハ取付板およびその製造方法
JPH03173129A (ja) 研磨装置
JPH03120718A (ja) チャック機構における半導体ウエハの取外し方法