JPS5827315A - セラミツクコンデンサの製造方法 - Google Patents

Info

Publication number

JPS5827315A

JPS5827315A JP12638781A JP12638781A JPS5827315A JP S5827315 A JPS5827315 A JP S5827315A JP 12638781 A JP12638781 A JP 12638781A JP 12638781 A JP12638781 A JP 12638781A JP S5827315 A JPS5827315 A JP S5827315A

Authority

JP

Japan

Prior art keywords

lead wire

ceramic body

capacitor

view

ceramic

Prior art date

1981-08-11

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Links

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• 239000000919 ceramic Substances 0.000 title claims description 57
• 238000000034 method Methods 0.000 title claims description 14
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 72
• 239000003990 capacitor Substances 0.000 claims description 36
• 229910000679 solder Inorganic materials 0.000 claims description 22
• 239000003985 ceramic capacitor Substances 0.000 claims description 18
• 238000003780 insertion Methods 0.000 claims description 9
• 230000037431 insertion Effects 0.000 claims description 9
• 238000004519 manufacturing process Methods 0.000 claims description 8
• 230000008018 melting Effects 0.000 claims description 5
• 238000002844 melting Methods 0.000 claims description 5
• 238000005476 soldering Methods 0.000 claims description 4
• 238000005520 cutting process Methods 0.000 claims description 3
• 238000007598 dipping method Methods 0.000 description 11
• 238000010586 diagram Methods 0.000 description 8
• 239000000463 material Substances 0.000 description 6
• 238000002360 preparation method Methods 0.000 description 6
• 239000004020 conductor Substances 0.000 description 3
• SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
• 230000002093 peripheral effect Effects 0.000 description 3
• BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
• KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
• 238000007772 electroless plating Methods 0.000 description 2
• 238000005245 sintering Methods 0.000 description 2
• 238000007711 solidification Methods 0.000 description 2
• 230000008023 solidification Effects 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 238000005452 bending Methods 0.000 description 1
• 230000015572 biosynthetic process Effects 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000010304 firing Methods 0.000 description 1
• 238000000227 grinding Methods 0.000 description 1
• 229910052763 palladium Inorganic materials 0.000 description 1
• 229910052697 platinum Inorganic materials 0.000 description 1