JPS5824464Y2 - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS5824464Y2
JPS5824464Y2 JP1977027534U JP2753477U JPS5824464Y2 JP S5824464 Y2 JPS5824464 Y2 JP S5824464Y2 JP 1977027534 U JP1977027534 U JP 1977027534U JP 2753477 U JP2753477 U JP 2753477U JP S5824464 Y2 JPS5824464 Y2 JP S5824464Y2
Authority
JP
Japan
Prior art keywords
resin
case
integrated circuit
gel
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977027534U
Other languages
English (en)
Japanese (ja)
Other versions
JPS53122650U (enExample
Inventor
勝三 伊藤
与志雄 秋田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP1977027534U priority Critical patent/JPS5824464Y2/ja
Publication of JPS53122650U publication Critical patent/JPS53122650U/ja
Application granted granted Critical
Publication of JPS5824464Y2 publication Critical patent/JPS5824464Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1977027534U 1977-03-08 1977-03-08 混成集積回路装置 Expired JPS5824464Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977027534U JPS5824464Y2 (ja) 1977-03-08 1977-03-08 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977027534U JPS5824464Y2 (ja) 1977-03-08 1977-03-08 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS53122650U JPS53122650U (enExample) 1978-09-29
JPS5824464Y2 true JPS5824464Y2 (ja) 1983-05-25

Family

ID=28871825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977027534U Expired JPS5824464Y2 (ja) 1977-03-08 1977-03-08 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS5824464Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102484102A (zh) * 2009-08-24 2012-05-30 本田技研工业株式会社 电子器件以及电子器件的制造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60216570A (ja) * 1984-04-12 1985-10-30 Toshiba Corp 半導体装置用外囲器のケ−ス
JPS60254643A (ja) * 1984-05-31 1985-12-16 Toshiba Corp 樹脂封止型半導体装置
JPS61148845A (ja) * 1984-12-21 1986-07-07 Mitsubishi Electric Corp 半導体装置
JP5548467B2 (ja) * 2010-01-29 2014-07-16 本田技研工業株式会社 電子装置、および、電子装置の製造方法
JP5357667B2 (ja) * 2009-08-24 2013-12-04 本田技研工業株式会社 電子装置の製造方法
JP6950796B2 (ja) * 2017-10-05 2021-10-13 カシオ計算機株式会社 電池モジュールの製造方法
JP6861622B2 (ja) * 2017-12-19 2021-04-21 三菱電機株式会社 半導体装置及び電力変換装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5041070Y2 (enExample) * 1971-02-26 1975-11-22

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102484102A (zh) * 2009-08-24 2012-05-30 本田技研工业株式会社 电子器件以及电子器件的制造方法

Also Published As

Publication number Publication date
JPS53122650U (enExample) 1978-09-29

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