JPS5824458Y2 - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS5824458Y2
JPS5824458Y2 JP1980029821U JP2982180U JPS5824458Y2 JP S5824458 Y2 JPS5824458 Y2 JP S5824458Y2 JP 1980029821 U JP1980029821 U JP 1980029821U JP 2982180 U JP2982180 U JP 2982180U JP S5824458 Y2 JPS5824458 Y2 JP S5824458Y2
Authority
JP
Japan
Prior art keywords
land
integrated circuit
hybrid integrated
probe
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980029821U
Other languages
English (en)
Japanese (ja)
Other versions
JPS56132762U (enExample
Inventor
良一 小崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1980029821U priority Critical patent/JPS5824458Y2/ja
Publication of JPS56132762U publication Critical patent/JPS56132762U/ja
Application granted granted Critical
Publication of JPS5824458Y2 publication Critical patent/JPS5824458Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Measuring Leads Or Probes (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP1980029821U 1980-03-10 1980-03-10 混成集積回路 Expired JPS5824458Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980029821U JPS5824458Y2 (ja) 1980-03-10 1980-03-10 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980029821U JPS5824458Y2 (ja) 1980-03-10 1980-03-10 混成集積回路

Publications (2)

Publication Number Publication Date
JPS56132762U JPS56132762U (enExample) 1981-10-08
JPS5824458Y2 true JPS5824458Y2 (ja) 1983-05-25

Family

ID=29625724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980029821U Expired JPS5824458Y2 (ja) 1980-03-10 1980-03-10 混成集積回路

Country Status (1)

Country Link
JP (1) JPS5824458Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009239090A (ja) * 2008-03-27 2009-10-15 Fujitsu Microelectronics Ltd パッドと半導体装置の製造方法

Also Published As

Publication number Publication date
JPS56132762U (enExample) 1981-10-08

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