JPS56132762U - - Google Patents
Info
- Publication number
- JPS56132762U JPS56132762U JP1980029821U JP2982180U JPS56132762U JP S56132762 U JPS56132762 U JP S56132762U JP 1980029821 U JP1980029821 U JP 1980029821U JP 2982180 U JP2982180 U JP 2982180U JP S56132762 U JPS56132762 U JP S56132762U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view
Landscapes
- Measuring Leads Or Probes (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980029821U JPS5824458Y2 (ja) | 1980-03-10 | 1980-03-10 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980029821U JPS5824458Y2 (ja) | 1980-03-10 | 1980-03-10 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56132762U true JPS56132762U (enExample) | 1981-10-08 |
| JPS5824458Y2 JPS5824458Y2 (ja) | 1983-05-25 |
Family
ID=29625724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980029821U Expired JPS5824458Y2 (ja) | 1980-03-10 | 1980-03-10 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5824458Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009239090A (ja) * | 2008-03-27 | 2009-10-15 | Fujitsu Microelectronics Ltd | パッドと半導体装置の製造方法 |
-
1980
- 1980-03-10 JP JP1980029821U patent/JPS5824458Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009239090A (ja) * | 2008-03-27 | 2009-10-15 | Fujitsu Microelectronics Ltd | パッドと半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5824458Y2 (ja) | 1983-05-25 |