JPS5823464A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5823464A
JPS5823464A JP56122655A JP12265581A JPS5823464A JP S5823464 A JPS5823464 A JP S5823464A JP 56122655 A JP56122655 A JP 56122655A JP 12265581 A JP12265581 A JP 12265581A JP S5823464 A JPS5823464 A JP S5823464A
Authority
JP
Japan
Prior art keywords
terminal
manufacturing
heat sink
integrated circuit
holding member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56122655A
Other languages
English (en)
Japanese (ja)
Other versions
JPS622702B2 (enrdf_load_stackoverflow
Inventor
Tsutomu Kamata
勉 鎌田
Takeyoshi Masuno
桝野　雄義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56122655A priority Critical patent/JPS5823464A/ja
Publication of JPS5823464A publication Critical patent/JPS5823464A/ja
Publication of JPS622702B2 publication Critical patent/JPS622702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56122655A 1981-08-04 1981-08-04 半導体装置の製造方法 Granted JPS5823464A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56122655A JPS5823464A (ja) 1981-08-04 1981-08-04 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56122655A JPS5823464A (ja) 1981-08-04 1981-08-04 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5823464A true JPS5823464A (ja) 1983-02-12
JPS622702B2 JPS622702B2 (enrdf_load_stackoverflow) 1987-01-21

Family

ID=14841344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56122655A Granted JPS5823464A (ja) 1981-08-04 1981-08-04 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5823464A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60258458A (ja) * 1984-06-06 1985-12-20 Mitsubishi Heavy Ind Ltd 溶融めつき装置
JPS61266560A (ja) * 1985-05-22 1986-11-26 Nippon Steel Corp 薄目付溶融メツキ法
JPS62103353A (ja) * 1985-10-31 1987-05-13 Nippon Steel Corp 薄目付溶融メツキ法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60258458A (ja) * 1984-06-06 1985-12-20 Mitsubishi Heavy Ind Ltd 溶融めつき装置
JPS61266560A (ja) * 1985-05-22 1986-11-26 Nippon Steel Corp 薄目付溶融メツキ法
JPS62103353A (ja) * 1985-10-31 1987-05-13 Nippon Steel Corp 薄目付溶融メツキ法

Also Published As

Publication number Publication date
JPS622702B2 (enrdf_load_stackoverflow) 1987-01-21

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