JPS58220435A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS58220435A
JPS58220435A JP57104351A JP10435182A JPS58220435A JP S58220435 A JPS58220435 A JP S58220435A JP 57104351 A JP57104351 A JP 57104351A JP 10435182 A JP10435182 A JP 10435182A JP S58220435 A JPS58220435 A JP S58220435A
Authority
JP
Japan
Prior art keywords
bonding
point
lead frame
devices
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57104351A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0141026B2 (enExample
Inventor
Nobuhito Yamazaki
山崎　信人
Masayuki Nakamura
雅之 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP57104351A priority Critical patent/JPS58220435A/ja
Publication of JPS58220435A publication Critical patent/JPS58220435A/ja
Publication of JPH0141026B2 publication Critical patent/JPH0141026B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0198—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07173—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP57104351A 1982-06-17 1982-06-17 ワイヤボンデイング方法 Granted JPS58220435A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57104351A JPS58220435A (ja) 1982-06-17 1982-06-17 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57104351A JPS58220435A (ja) 1982-06-17 1982-06-17 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS58220435A true JPS58220435A (ja) 1983-12-22
JPH0141026B2 JPH0141026B2 (enExample) 1989-09-01

Family

ID=14378455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57104351A Granted JPS58220435A (ja) 1982-06-17 1982-06-17 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS58220435A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100616497B1 (ko) * 1999-12-30 2006-08-28 주식회사 하이닉스반도체 와이어본딩 장치와 그를 이용한 본딩 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100616497B1 (ko) * 1999-12-30 2006-08-28 주식회사 하이닉스반도체 와이어본딩 장치와 그를 이용한 본딩 방법

Also Published As

Publication number Publication date
JPH0141026B2 (enExample) 1989-09-01

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