JPS58217313A - 樹脂モ−ルド方法 - Google Patents

樹脂モ−ルド方法

Info

Publication number
JPS58217313A
JPS58217313A JP57086184A JP8618482A JPS58217313A JP S58217313 A JPS58217313 A JP S58217313A JP 57086184 A JP57086184 A JP 57086184A JP 8618482 A JP8618482 A JP 8618482A JP S58217313 A JPS58217313 A JP S58217313A
Authority
JP
Japan
Prior art keywords
resin
gate
mold
runner
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57086184A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0237856B2 (enExample
Inventor
Takao Murase
孝夫 村瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP57086184A priority Critical patent/JPS58217313A/ja
Publication of JPS58217313A publication Critical patent/JPS58217313A/ja
Publication of JPH0237856B2 publication Critical patent/JPH0237856B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP57086184A 1982-05-20 1982-05-20 樹脂モ−ルド方法 Granted JPS58217313A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57086184A JPS58217313A (ja) 1982-05-20 1982-05-20 樹脂モ−ルド方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57086184A JPS58217313A (ja) 1982-05-20 1982-05-20 樹脂モ−ルド方法

Publications (2)

Publication Number Publication Date
JPS58217313A true JPS58217313A (ja) 1983-12-17
JPH0237856B2 JPH0237856B2 (enExample) 1990-08-28

Family

ID=13879675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57086184A Granted JPS58217313A (ja) 1982-05-20 1982-05-20 樹脂モ−ルド方法

Country Status (1)

Country Link
JP (1) JPS58217313A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900501A (en) * 1985-11-08 1990-02-13 Hitachi, Ltd. Method and apparatus for encapsulating semi-conductors
US4946633A (en) * 1987-04-27 1990-08-07 Hitachi, Ltd. Method of producing semiconductor devices
JPH02203544A (ja) * 1989-02-01 1990-08-13 Hitachi Ltd 成形装置
US4983110A (en) * 1988-03-14 1991-01-08 Hitachi, Ltd. Resin encapsulating apparatus for semiconductor devices
KR100640556B1 (ko) * 2006-03-09 2006-11-01 주식회사 티에스피 반도체 장치

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900501A (en) * 1985-11-08 1990-02-13 Hitachi, Ltd. Method and apparatus for encapsulating semi-conductors
US4946633A (en) * 1987-04-27 1990-08-07 Hitachi, Ltd. Method of producing semiconductor devices
US4983110A (en) * 1988-03-14 1991-01-08 Hitachi, Ltd. Resin encapsulating apparatus for semiconductor devices
JPH02203544A (ja) * 1989-02-01 1990-08-13 Hitachi Ltd 成形装置
KR100640556B1 (ko) * 2006-03-09 2006-11-01 주식회사 티에스피 반도체 장치

Also Published As

Publication number Publication date
JPH0237856B2 (enExample) 1990-08-28

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