JPH0237856B2 - - Google Patents

Info

Publication number
JPH0237856B2
JPH0237856B2 JP57086184A JP8618482A JPH0237856B2 JP H0237856 B2 JPH0237856 B2 JP H0237856B2 JP 57086184 A JP57086184 A JP 57086184A JP 8618482 A JP8618482 A JP 8618482A JP H0237856 B2 JPH0237856 B2 JP H0237856B2
Authority
JP
Japan
Prior art keywords
resin
runner
mold
gate
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57086184A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58217313A (ja
Inventor
Takao Murase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
Original Assignee
NEC Home Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd filed Critical NEC Home Electronics Ltd
Priority to JP57086184A priority Critical patent/JPS58217313A/ja
Publication of JPS58217313A publication Critical patent/JPS58217313A/ja
Publication of JPH0237856B2 publication Critical patent/JPH0237856B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP57086184A 1982-05-20 1982-05-20 樹脂モ−ルド方法 Granted JPS58217313A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57086184A JPS58217313A (ja) 1982-05-20 1982-05-20 樹脂モ−ルド方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57086184A JPS58217313A (ja) 1982-05-20 1982-05-20 樹脂モ−ルド方法

Publications (2)

Publication Number Publication Date
JPS58217313A JPS58217313A (ja) 1983-12-17
JPH0237856B2 true JPH0237856B2 (enExample) 1990-08-28

Family

ID=13879675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57086184A Granted JPS58217313A (ja) 1982-05-20 1982-05-20 樹脂モ−ルド方法

Country Status (1)

Country Link
JP (1) JPS58217313A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122136A (ja) * 1985-11-08 1987-06-03 Hitachi Ltd レジンモールド半導体の製造方法および装置
US4946633A (en) * 1987-04-27 1990-08-07 Hitachi, Ltd. Method of producing semiconductor devices
KR920005448B1 (ko) * 1988-03-14 1992-07-04 가부시끼가이샤 히다찌세이사꾸쇼 반도체 소자의 수지봉지장치 및 그것을 사용한 반도체 소자의 수지봉지방법
JP2724491B2 (ja) * 1989-02-01 1998-03-09 株式会社日立製作所 成形装置
KR100640556B1 (ko) * 2006-03-09 2006-11-01 주식회사 티에스피 반도체 장치

Also Published As

Publication number Publication date
JPS58217313A (ja) 1983-12-17

Similar Documents

Publication Publication Date Title
JPH0890605A (ja) 樹脂封止用金型および半導体装置の製造方法
JP2003158234A (ja) 半導体装置及びその製造方法
US7732910B2 (en) Lead frame including suspending leads having trenches formed therein
JPH0574999A (ja) 半導体装置及びその製造方法
JP2973901B2 (ja) 半導体樹脂封止用金型
JP3293105B2 (ja) 半導体中間構体及びその樹脂モールド装置
JP3076949B2 (ja) リードフレーム
JP2542920B2 (ja) 半導体装置の樹脂モ―ルド方法
JPS58217313A (ja) 樹脂モ−ルド方法
JP3189927B2 (ja) リードフレームおよびこれを用いた半導体装置の製造方法
JPH0753384B2 (ja) モ−ルド金型
JPH0644105Y2 (ja) 樹脂モ−ルド型半導体装置のリ−ドフレ−ム
JP3112227B2 (ja) 半導体装置の製造方法
JPH0793345B2 (ja) フィルムキャリアとこれを用いるモールド方法
JP3394463B2 (ja) 樹脂封止型半導体装置のモールド金型及びそのリードフレーム
JPS5933838A (ja) 半導体樹脂封止用金型装置
JPH0110182Y2 (enExample)
JP3458907B2 (ja) リードフレーム
JP2966033B2 (ja) 成形装置
JPH05293846A (ja) 成形装置
JP2003203935A (ja) 半導体装置の封止方法およびそれに用いる封止装置
JPH0314332Y2 (enExample)
JP2802966B2 (ja) 樹脂封止型電子部品の製造方法
JPS62193132A (ja) モ−ルド方法およびそのモ−ルド型
JPH0341755A (ja) 半導体装置の製造方法およびリードフレーム