JPS5821360A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5821360A
JPS5821360A JP56119483A JP11948381A JPS5821360A JP S5821360 A JPS5821360 A JP S5821360A JP 56119483 A JP56119483 A JP 56119483A JP 11948381 A JP11948381 A JP 11948381A JP S5821360 A JPS5821360 A JP S5821360A
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor devices
semiconductor
spacer
electrode body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56119483A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0249022B2 (cs
Inventor
Jiro Kakehi
筧　二朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP56119483A priority Critical patent/JPS5821360A/ja
Publication of JPS5821360A publication Critical patent/JPS5821360A/ja
Publication of JPH0249022B2 publication Critical patent/JPH0249022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP56119483A 1981-07-29 1981-07-29 半導体装置の製造方法 Granted JPS5821360A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56119483A JPS5821360A (ja) 1981-07-29 1981-07-29 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56119483A JPS5821360A (ja) 1981-07-29 1981-07-29 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5821360A true JPS5821360A (ja) 1983-02-08
JPH0249022B2 JPH0249022B2 (cs) 1990-10-26

Family

ID=14762395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56119483A Granted JPS5821360A (ja) 1981-07-29 1981-07-29 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5821360A (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62178539U (cs) * 1986-04-30 1987-11-12
US7199455B2 (en) 2002-07-02 2007-04-03 Nec Electronics Corporation Molded resin semiconductor device having exposed semiconductor chip electrodes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62178539U (cs) * 1986-04-30 1987-11-12
US7199455B2 (en) 2002-07-02 2007-04-03 Nec Electronics Corporation Molded resin semiconductor device having exposed semiconductor chip electrodes
US7534661B2 (en) 2002-07-02 2009-05-19 Nec Electronics Corporation Method of forming molded resin semiconductor device

Also Published As

Publication number Publication date
JPH0249022B2 (cs) 1990-10-26

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