JPS582080A - Ledランプ - Google Patents

Ledランプ

Info

Publication number
JPS582080A
JPS582080A JP56099722A JP9972281A JPS582080A JP S582080 A JPS582080 A JP S582080A JP 56099722 A JP56099722 A JP 56099722A JP 9972281 A JP9972281 A JP 9972281A JP S582080 A JPS582080 A JP S582080A
Authority
JP
Japan
Prior art keywords
lamp
outer shell
lead wire
contact
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56099722A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6244839B2 (enrdf_load_stackoverflow
Inventor
Osamu Abe
修 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Denyo Co Ltd
Original Assignee
Nippon Denyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Denyo Co Ltd filed Critical Nippon Denyo Co Ltd
Priority to JP56099722A priority Critical patent/JPS582080A/ja
Publication of JPS582080A publication Critical patent/JPS582080A/ja
Publication of JPS6244839B2 publication Critical patent/JPS6244839B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Mounting Components In General For Electric Apparatus (AREA)
  • Led Device Packages (AREA)
JP56099722A 1981-06-29 1981-06-29 Ledランプ Granted JPS582080A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56099722A JPS582080A (ja) 1981-06-29 1981-06-29 Ledランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56099722A JPS582080A (ja) 1981-06-29 1981-06-29 Ledランプ

Publications (2)

Publication Number Publication Date
JPS582080A true JPS582080A (ja) 1983-01-07
JPS6244839B2 JPS6244839B2 (enrdf_load_stackoverflow) 1987-09-22

Family

ID=14254961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56099722A Granted JPS582080A (ja) 1981-06-29 1981-06-29 Ledランプ

Country Status (1)

Country Link
JP (1) JPS582080A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6037261U (ja) * 1983-08-22 1985-03-14 舶用電球株式会社 発光ダイオ−ドランプの発光部の放熱構造
JPS6092851U (ja) * 1983-12-01 1985-06-25 舶用電球株式会社 発光ダイオ−ドランプの発光部
JPH0311771A (ja) * 1989-05-31 1991-01-21 Siemens Ag 表面実装可能なオプトデバイス
US5396086A (en) * 1993-08-24 1995-03-07 Dialight Corporation LED spacer assembly
WO2002089222A1 (en) * 2001-04-26 2002-11-07 Moriyama Sangyo Kabushiki Kaisha Light source coupler, illuminant device, patterned conductor, and method for manufcturing light source coupler
US7380961B2 (en) 2002-04-24 2008-06-03 Moriyama Sangyo Kabushiki Kaisha Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5257797A (en) * 1975-10-31 1977-05-12 Western Electric Co Light emitting display unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5257797A (en) * 1975-10-31 1977-05-12 Western Electric Co Light emitting display unit

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6037261U (ja) * 1983-08-22 1985-03-14 舶用電球株式会社 発光ダイオ−ドランプの発光部の放熱構造
JPS6092851U (ja) * 1983-12-01 1985-06-25 舶用電球株式会社 発光ダイオ−ドランプの発光部
JPH0311771A (ja) * 1989-05-31 1991-01-21 Siemens Ag 表面実装可能なオプトデバイス
US5396086A (en) * 1993-08-24 1995-03-07 Dialight Corporation LED spacer assembly
WO2002089222A1 (en) * 2001-04-26 2002-11-07 Moriyama Sangyo Kabushiki Kaisha Light source coupler, illuminant device, patterned conductor, and method for manufcturing light source coupler
US7380961B2 (en) 2002-04-24 2008-06-03 Moriyama Sangyo Kabushiki Kaisha Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler

Also Published As

Publication number Publication date
JPS6244839B2 (enrdf_load_stackoverflow) 1987-09-22

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