JPS582080A - Ledランプ - Google Patents
LedランプInfo
- Publication number
- JPS582080A JPS582080A JP56099722A JP9972281A JPS582080A JP S582080 A JPS582080 A JP S582080A JP 56099722 A JP56099722 A JP 56099722A JP 9972281 A JP9972281 A JP 9972281A JP S582080 A JPS582080 A JP S582080A
- Authority
- JP
- Japan
- Prior art keywords
- lamp
- outer shell
- lead wire
- contact
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56099722A JPS582080A (ja) | 1981-06-29 | 1981-06-29 | Ledランプ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56099722A JPS582080A (ja) | 1981-06-29 | 1981-06-29 | Ledランプ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS582080A true JPS582080A (ja) | 1983-01-07 |
JPS6244839B2 JPS6244839B2 (enrdf_load_stackoverflow) | 1987-09-22 |
Family
ID=14254961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56099722A Granted JPS582080A (ja) | 1981-06-29 | 1981-06-29 | Ledランプ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS582080A (enrdf_load_stackoverflow) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6037261U (ja) * | 1983-08-22 | 1985-03-14 | 舶用電球株式会社 | 発光ダイオ−ドランプの発光部の放熱構造 |
JPS6092851U (ja) * | 1983-12-01 | 1985-06-25 | 舶用電球株式会社 | 発光ダイオ−ドランプの発光部 |
JPH0311771A (ja) * | 1989-05-31 | 1991-01-21 | Siemens Ag | 表面実装可能なオプトデバイス |
US5396086A (en) * | 1993-08-24 | 1995-03-07 | Dialight Corporation | LED spacer assembly |
WO2002089222A1 (en) * | 2001-04-26 | 2002-11-07 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufcturing light source coupler |
US7380961B2 (en) | 2002-04-24 | 2008-06-03 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5257797A (en) * | 1975-10-31 | 1977-05-12 | Western Electric Co | Light emitting display unit |
-
1981
- 1981-06-29 JP JP56099722A patent/JPS582080A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5257797A (en) * | 1975-10-31 | 1977-05-12 | Western Electric Co | Light emitting display unit |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6037261U (ja) * | 1983-08-22 | 1985-03-14 | 舶用電球株式会社 | 発光ダイオ−ドランプの発光部の放熱構造 |
JPS6092851U (ja) * | 1983-12-01 | 1985-06-25 | 舶用電球株式会社 | 発光ダイオ−ドランプの発光部 |
JPH0311771A (ja) * | 1989-05-31 | 1991-01-21 | Siemens Ag | 表面実装可能なオプトデバイス |
US5396086A (en) * | 1993-08-24 | 1995-03-07 | Dialight Corporation | LED spacer assembly |
WO2002089222A1 (en) * | 2001-04-26 | 2002-11-07 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufcturing light source coupler |
US7380961B2 (en) | 2002-04-24 | 2008-06-03 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler |
Also Published As
Publication number | Publication date |
---|---|
JPS6244839B2 (enrdf_load_stackoverflow) | 1987-09-22 |
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