JPS5820159B2 - 交叉配線を有する薄膜回路基板の製造方法 - Google Patents

交叉配線を有する薄膜回路基板の製造方法

Info

Publication number
JPS5820159B2
JPS5820159B2 JP49105838A JP10583874A JPS5820159B2 JP S5820159 B2 JPS5820159 B2 JP S5820159B2 JP 49105838 A JP49105838 A JP 49105838A JP 10583874 A JP10583874 A JP 10583874A JP S5820159 B2 JPS5820159 B2 JP S5820159B2
Authority
JP
Japan
Prior art keywords
thin film
film conductor
thick film
conductor layer
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49105838A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5132954A (enrdf_load_stackoverflow
Inventor
秋武昌平
中村肇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP49105838A priority Critical patent/JPS5820159B2/ja
Publication of JPS5132954A publication Critical patent/JPS5132954A/ja
Publication of JPS5820159B2 publication Critical patent/JPS5820159B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP49105838A 1974-09-13 1974-09-13 交叉配線を有する薄膜回路基板の製造方法 Expired JPS5820159B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49105838A JPS5820159B2 (ja) 1974-09-13 1974-09-13 交叉配線を有する薄膜回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49105838A JPS5820159B2 (ja) 1974-09-13 1974-09-13 交叉配線を有する薄膜回路基板の製造方法

Publications (2)

Publication Number Publication Date
JPS5132954A JPS5132954A (enrdf_load_stackoverflow) 1976-03-19
JPS5820159B2 true JPS5820159B2 (ja) 1983-04-21

Family

ID=14418159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49105838A Expired JPS5820159B2 (ja) 1974-09-13 1974-09-13 交叉配線を有する薄膜回路基板の製造方法

Country Status (1)

Country Link
JP (1) JPS5820159B2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5895668U (ja) * 1981-12-22 1983-06-29 松下電器産業株式会社 印刷配線基板
JP6380726B1 (ja) * 2016-12-21 2018-08-29 大日本印刷株式会社 貫通電極基板、半導体装置及び貫通電極基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5141516B2 (enrdf_load_stackoverflow) * 1971-10-29 1976-11-10
JPS4879987A (enrdf_load_stackoverflow) * 1972-01-28 1973-10-26
JPS494994A (enrdf_load_stackoverflow) * 1972-04-27 1974-01-17

Also Published As

Publication number Publication date
JPS5132954A (enrdf_load_stackoverflow) 1976-03-19

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