JPS5820159B2 - 交叉配線を有する薄膜回路基板の製造方法 - Google Patents
交叉配線を有する薄膜回路基板の製造方法Info
- Publication number
- JPS5820159B2 JPS5820159B2 JP49105838A JP10583874A JPS5820159B2 JP S5820159 B2 JPS5820159 B2 JP S5820159B2 JP 49105838 A JP49105838 A JP 49105838A JP 10583874 A JP10583874 A JP 10583874A JP S5820159 B2 JPS5820159 B2 JP S5820159B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film conductor
- thick film
- conductor layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49105838A JPS5820159B2 (ja) | 1974-09-13 | 1974-09-13 | 交叉配線を有する薄膜回路基板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49105838A JPS5820159B2 (ja) | 1974-09-13 | 1974-09-13 | 交叉配線を有する薄膜回路基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5132954A JPS5132954A (enrdf_load_stackoverflow) | 1976-03-19 |
JPS5820159B2 true JPS5820159B2 (ja) | 1983-04-21 |
Family
ID=14418159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP49105838A Expired JPS5820159B2 (ja) | 1974-09-13 | 1974-09-13 | 交叉配線を有する薄膜回路基板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5820159B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5895668U (ja) * | 1981-12-22 | 1983-06-29 | 松下電器産業株式会社 | 印刷配線基板 |
WO2018117111A1 (ja) * | 2016-12-21 | 2018-06-28 | 大日本印刷株式会社 | 貫通電極基板、半導体装置及び貫通電極基板の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5141516B2 (enrdf_load_stackoverflow) * | 1971-10-29 | 1976-11-10 | ||
JPS4879987A (enrdf_load_stackoverflow) * | 1972-01-28 | 1973-10-26 | ||
JPS494994A (enrdf_load_stackoverflow) * | 1972-04-27 | 1974-01-17 |
-
1974
- 1974-09-13 JP JP49105838A patent/JPS5820159B2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5132954A (enrdf_load_stackoverflow) | 1976-03-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7557014B2 (en) | Semiconductor system-in-package | |
US4439813A (en) | Thin film discrete decoupling capacitor | |
JPH0358550B2 (enrdf_load_stackoverflow) | ||
JPS5820159B2 (ja) | 交叉配線を有する薄膜回路基板の製造方法 | |
JPH0363237B2 (enrdf_load_stackoverflow) | ||
JP2545107B2 (ja) | 回路基板 | |
JP2530008B2 (ja) | 配線基板の製造方法 | |
JPS6347952A (ja) | 半導体装置 | |
JPH0225276B2 (enrdf_load_stackoverflow) | ||
JPS62242325A (ja) | チツプコンデンサ−の製造方法 | |
JPH07263865A (ja) | 薄膜多層配線基板 | |
JPH03104190A (ja) | 多層配線板およびその製造方法 | |
JPH0824215B2 (ja) | 厚膜回路装置の製造方法 | |
JPS58186996A (ja) | 多層回路基板の製造方法 | |
JPS61256688A (ja) | 回路基板の製造方法 | |
JPS6146973B2 (enrdf_load_stackoverflow) | ||
JPH08222626A (ja) | 電極パッドの形成方法 | |
JPH06140215A (ja) | 薄膜抵抗体とそれを内蔵した多層回路基板の製造方法 | |
JPS63177582A (ja) | 混成集積回路装置の製造方法 | |
JPS62171194A (ja) | マトリクス配線板 | |
JPS5893298A (ja) | 多層配線基板 | |
JPS58147097A (ja) | 多層配線板の製造方法 | |
JPS6191994A (ja) | 電子回路装置 | |
JPS61147597A (ja) | セラミック回路基板の製造方法 | |
JPS6052095A (ja) | 多層配線基板およびその製造方法 |