JPS58201393A - 電子回路部品構体 - Google Patents
電子回路部品構体Info
- Publication number
- JPS58201393A JPS58201393A JP8585582A JP8585582A JPS58201393A JP S58201393 A JPS58201393 A JP S58201393A JP 8585582 A JP8585582 A JP 8585582A JP 8585582 A JP8585582 A JP 8585582A JP S58201393 A JPS58201393 A JP S58201393A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- printed wiring
- wiring board
- board
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 20
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 14
- 230000010354 integration Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241000277269 Oncorhynchus masou Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8585582A JPS58201393A (ja) | 1982-05-20 | 1982-05-20 | 電子回路部品構体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8585582A JPS58201393A (ja) | 1982-05-20 | 1982-05-20 | 電子回路部品構体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58201393A true JPS58201393A (ja) | 1983-11-24 |
| JPS6230719B2 JPS6230719B2 (en, 2012) | 1987-07-03 |
Family
ID=13870487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8585582A Granted JPS58201393A (ja) | 1982-05-20 | 1982-05-20 | 電子回路部品構体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58201393A (en, 2012) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61207069U (en, 2012) * | 1985-06-14 | 1986-12-27 | ||
| JPS62226691A (ja) * | 1986-03-28 | 1987-10-05 | スナオ電気株式会社 | 電気機械器具における基板ユニツトの製造方法及びその方法の実施に直接使用するプリント配線基板 |
| JPS6375074U (en, 2012) * | 1986-11-04 | 1988-05-19 | ||
| JPH05335695A (ja) * | 1992-06-02 | 1993-12-17 | Nec Corp | シングルインラインモジュール |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4822747U (en, 2012) * | 1971-07-23 | 1973-03-15 | ||
| JPS5225264A (en) * | 1975-08-21 | 1977-02-25 | Matsushita Electric Ind Co Ltd | Hybrid miniature parts |
| JPS5426671U (en, 2012) * | 1977-07-26 | 1979-02-21 |
-
1982
- 1982-05-20 JP JP8585582A patent/JPS58201393A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4822747U (en, 2012) * | 1971-07-23 | 1973-03-15 | ||
| JPS5225264A (en) * | 1975-08-21 | 1977-02-25 | Matsushita Electric Ind Co Ltd | Hybrid miniature parts |
| JPS5426671U (en, 2012) * | 1977-07-26 | 1979-02-21 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61207069U (en, 2012) * | 1985-06-14 | 1986-12-27 | ||
| JPS62226691A (ja) * | 1986-03-28 | 1987-10-05 | スナオ電気株式会社 | 電気機械器具における基板ユニツトの製造方法及びその方法の実施に直接使用するプリント配線基板 |
| JPS6375074U (en, 2012) * | 1986-11-04 | 1988-05-19 | ||
| JPH05335695A (ja) * | 1992-06-02 | 1993-12-17 | Nec Corp | シングルインラインモジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6230719B2 (en, 2012) | 1987-07-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH05508972A (ja) | 自動車・エレクトロニクス用のケーシング | |
| JPS6266506A (ja) | 多層セラミツクコンデンサ−を含む高静電容量ブスバ− | |
| JPS58201393A (ja) | 電子回路部品構体 | |
| JPH0430741B2 (en, 2012) | ||
| JPS62155585A (ja) | 電子機器 | |
| JPS598370Y2 (ja) | 電気回路ユニツト | |
| JPS5830189A (ja) | 微小回路素子の製造法 | |
| JPH0442937Y2 (en, 2012) | ||
| JPH06208902A (ja) | 電子部品 | |
| JPH056715Y2 (en, 2012) | ||
| JPH0534133Y2 (en, 2012) | ||
| JPS60140785A (ja) | ハイブリッドｉｃの実装構造 | |
| JPS60242693A (ja) | 印刷配線板とその製造方法 | |
| JPS5965494A (ja) | 電子回路基板の実装方法 | |
| JPS6347248B2 (en, 2012) | ||
| JPH04118958A (ja) | 表面実装用多層型配線基板 | |
| JPS60115287A (ja) | 混成集積回路装置 | |
| JPS5956701A (ja) | チツプ抵抗 | |
| JPS5867099A (ja) | 電気機器 | |
| JPS5848496A (ja) | 小型電子回路部品構体 | |
| JPH06132473A (ja) | ハイブリッドｉｃ | |
| JP2744108B2 (ja) | 混成集積回路素子 | |
| JPS5926613Y2 (ja) | 電子部品取付構体 | |
| JPS58216495A (ja) | プリント配線基板 | |
| JPS62115761A (ja) | 混成集積回路 |