JPS58198525A - エポキシ樹脂組成物 - Google Patents
エポキシ樹脂組成物Info
- Publication number
- JPS58198525A JPS58198525A JP57082164A JP8216482A JPS58198525A JP S58198525 A JPS58198525 A JP S58198525A JP 57082164 A JP57082164 A JP 57082164A JP 8216482 A JP8216482 A JP 8216482A JP S58198525 A JPS58198525 A JP S58198525A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- composition
- curing
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 28
- 239000000203 mixture Substances 0.000 title claims abstract description 28
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 28
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 10
- 239000005011 phenolic resin Substances 0.000 claims abstract description 9
- 239000011256 inorganic filler Substances 0.000 claims abstract description 7
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 7
- 239000003063 flame retardant Substances 0.000 claims description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 5
- 238000011417 postcuring Methods 0.000 abstract description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 abstract description 5
- 229920001568 phenolic resin Polymers 0.000 abstract description 5
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 abstract description 4
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 4
- -1 phthalic anhydride) Chemical class 0.000 abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011342 resin composition Substances 0.000 abstract description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 abstract description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 3
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 abstract 1
- GVSNQMFKEPBIOY-UHFFFAOYSA-N 4-methyl-2h-triazole Chemical compound CC=1C=NNN=1 GVSNQMFKEPBIOY-UHFFFAOYSA-N 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 150000003852 triazoles Chemical class 0.000 abstract 1
- 229920003986 novolac Polymers 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910001868 water Inorganic materials 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 235000003385 Diospyros ebenum Nutrition 0.000 description 2
- 241000792913 Ebenaceae Species 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 244000001591 balata Species 0.000 description 1
- 235000016302 balata Nutrition 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000003869 coulometry Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 125000005590 trimellitic acid group Chemical class 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57082164A JPS58198525A (ja) | 1982-05-14 | 1982-05-14 | エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57082164A JPS58198525A (ja) | 1982-05-14 | 1982-05-14 | エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58198525A true JPS58198525A (ja) | 1983-11-18 |
| JPS6230215B2 JPS6230215B2 (enrdf_load_stackoverflow) | 1987-07-01 |
Family
ID=13766783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57082164A Granted JPS58198525A (ja) | 1982-05-14 | 1982-05-14 | エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58198525A (enrdf_load_stackoverflow) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60190418A (ja) * | 1984-03-12 | 1985-09-27 | Mitsubishi Electric Corp | 半導体封止用液状エポキシ樹脂組成物 |
| JPS61101524A (ja) * | 1984-10-25 | 1986-05-20 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JPS62161820A (ja) * | 1986-01-10 | 1987-07-17 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
| JPS6361016A (ja) * | 1986-08-29 | 1988-03-17 | New Japan Chem Co Ltd | エポキシ樹脂硬化剤組成物 |
| JPS63234013A (ja) * | 1987-03-23 | 1988-09-29 | Tatsuta Electric Wire & Cable Co Ltd | 半導体封止用樹脂組成物 |
| JPH01242616A (ja) * | 1988-03-23 | 1989-09-27 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| JPH01287131A (ja) * | 1988-03-23 | 1989-11-17 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物及び硬化促進剤 |
| JPH04248876A (ja) * | 1991-01-25 | 1992-09-04 | Somar Corp | 粉体塗料用エポキシ樹脂組成物 |
| EP1184419A3 (en) * | 2000-08-24 | 2003-04-02 | Nitto Denko Corporation | Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device |
| WO2005037888A1 (ja) * | 2003-10-20 | 2005-04-28 | Sumitomo Bakelite Co., Ltd. | エポキシ樹脂組成物および半導体装置 |
| JP2005120289A (ja) * | 2003-10-20 | 2005-05-12 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2005281582A (ja) * | 2004-03-30 | 2005-10-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2006143952A (ja) * | 2004-11-24 | 2006-06-08 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2006176555A (ja) * | 2004-12-21 | 2006-07-06 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2006182803A (ja) * | 2004-12-24 | 2006-07-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02208611A (ja) * | 1989-02-08 | 1990-08-20 | Sumitomo Electric Ind Ltd | ノンメタリック光ファイバケーブル |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49122598A (enrdf_load_stackoverflow) * | 1973-03-30 | 1974-11-22 | ||
| JPS5328960A (en) * | 1976-08-30 | 1978-03-17 | Kubota Ltd | Nitration treatment |
| JPS53111398A (en) * | 1977-03-11 | 1978-09-28 | Hitachi Ltd | Epoxy resin composition |
| JPS5454199A (en) * | 1977-10-07 | 1979-04-28 | Hitachi Ltd | Epoxy resin composition |
-
1982
- 1982-05-14 JP JP57082164A patent/JPS58198525A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49122598A (enrdf_load_stackoverflow) * | 1973-03-30 | 1974-11-22 | ||
| JPS5328960A (en) * | 1976-08-30 | 1978-03-17 | Kubota Ltd | Nitration treatment |
| JPS53111398A (en) * | 1977-03-11 | 1978-09-28 | Hitachi Ltd | Epoxy resin composition |
| JPS5454199A (en) * | 1977-10-07 | 1979-04-28 | Hitachi Ltd | Epoxy resin composition |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60190418A (ja) * | 1984-03-12 | 1985-09-27 | Mitsubishi Electric Corp | 半導体封止用液状エポキシ樹脂組成物 |
| JPS61101524A (ja) * | 1984-10-25 | 1986-05-20 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JPS62161820A (ja) * | 1986-01-10 | 1987-07-17 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
| JPS6361016A (ja) * | 1986-08-29 | 1988-03-17 | New Japan Chem Co Ltd | エポキシ樹脂硬化剤組成物 |
| JPS63234013A (ja) * | 1987-03-23 | 1988-09-29 | Tatsuta Electric Wire & Cable Co Ltd | 半導体封止用樹脂組成物 |
| JPH01242616A (ja) * | 1988-03-23 | 1989-09-27 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| JPH01287131A (ja) * | 1988-03-23 | 1989-11-17 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物及び硬化促進剤 |
| JPH04248876A (ja) * | 1991-01-25 | 1992-09-04 | Somar Corp | 粉体塗料用エポキシ樹脂組成物 |
| US5418265A (en) * | 1991-01-25 | 1995-05-23 | Somar Corporation | Powder epoxy resin coating composition |
| EP1184419A3 (en) * | 2000-08-24 | 2003-04-02 | Nitto Denko Corporation | Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device |
| WO2005037888A1 (ja) * | 2003-10-20 | 2005-04-28 | Sumitomo Bakelite Co., Ltd. | エポキシ樹脂組成物および半導体装置 |
| JP2005120289A (ja) * | 2003-10-20 | 2005-05-12 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JPWO2005037888A1 (ja) * | 2003-10-20 | 2007-11-22 | 住友ベークライト株式会社 | エポキシ樹脂組成物および半導体装置 |
| US7354978B2 (en) | 2003-10-20 | 2008-04-08 | Sumitomo Bakelite Co. | Semiconductor encapsulant of epoxy resin, phenolic resin and triazole compound |
| CN100402575C (zh) * | 2003-10-20 | 2008-07-16 | 住友电木株式会社 | 环氧树脂组合物及半导体装置 |
| KR101055113B1 (ko) | 2003-10-20 | 2011-08-08 | 스미토모 베이클라이트 가부시키가이샤 | 에폭시 수지조성물 및 반도체장치 |
| JP2005281582A (ja) * | 2004-03-30 | 2005-10-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2006143952A (ja) * | 2004-11-24 | 2006-06-08 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2006176555A (ja) * | 2004-12-21 | 2006-07-06 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2006182803A (ja) * | 2004-12-24 | 2006-07-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6230215B2 (enrdf_load_stackoverflow) | 1987-07-01 |
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