JPS58196863U - 半導体レ−ザ用サブマウント - Google Patents
半導体レ−ザ用サブマウントInfo
- Publication number
- JPS58196863U JPS58196863U JP9554682U JP9554682U JPS58196863U JP S58196863 U JPS58196863 U JP S58196863U JP 9554682 U JP9554682 U JP 9554682U JP 9554682 U JP9554682 U JP 9554682U JP S58196863 U JPS58196863 U JP S58196863U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- melting point
- submount
- gold
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9554682U JPS58196863U (ja) | 1982-06-24 | 1982-06-24 | 半導体レ−ザ用サブマウント |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9554682U JPS58196863U (ja) | 1982-06-24 | 1982-06-24 | 半導体レ−ザ用サブマウント |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58196863U true JPS58196863U (ja) | 1983-12-27 |
| JPS6244552Y2 JPS6244552Y2 (enExample) | 1987-11-25 |
Family
ID=30228122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9554682U Granted JPS58196863U (ja) | 1982-06-24 | 1982-06-24 | 半導体レ−ザ用サブマウント |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58196863U (enExample) |
-
1982
- 1982-06-24 JP JP9554682U patent/JPS58196863U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6244552Y2 (enExample) | 1987-11-25 |
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