JPS58192370A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS58192370A JPS58192370A JP57075223A JP7522382A JPS58192370A JP S58192370 A JPS58192370 A JP S58192370A JP 57075223 A JP57075223 A JP 57075223A JP 7522382 A JP7522382 A JP 7522382A JP S58192370 A JPS58192370 A JP S58192370A
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- semiconductor device
- wafer
- layer
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
Landscapes
- Electrodes Of Semiconductors (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57075223A JPS58192370A (ja) | 1982-05-07 | 1982-05-07 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57075223A JPS58192370A (ja) | 1982-05-07 | 1982-05-07 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58192370A true JPS58192370A (ja) | 1983-11-09 |
JPH0423821B2 JPH0423821B2 (enrdf_load_stackoverflow) | 1992-04-23 |
Family
ID=13570008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57075223A Granted JPS58192370A (ja) | 1982-05-07 | 1982-05-07 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58192370A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0460531A1 (de) * | 1990-06-07 | 1991-12-11 | Siemens Aktiengesellschaft | Kontaktmetallisierung auf Halbleitermaterial |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5092083A (enrdf_load_stackoverflow) * | 1973-12-12 | 1975-07-23 |
-
1982
- 1982-05-07 JP JP57075223A patent/JPS58192370A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5092083A (enrdf_load_stackoverflow) * | 1973-12-12 | 1975-07-23 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0460531A1 (de) * | 1990-06-07 | 1991-12-11 | Siemens Aktiengesellschaft | Kontaktmetallisierung auf Halbleitermaterial |
Also Published As
Publication number | Publication date |
---|---|
JPH0423821B2 (enrdf_load_stackoverflow) | 1992-04-23 |
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