JPS58186995A - 多層厚膜集積回路基板 - Google Patents
多層厚膜集積回路基板Info
- Publication number
- JPS58186995A JPS58186995A JP57069774A JP6977482A JPS58186995A JP S58186995 A JPS58186995 A JP S58186995A JP 57069774 A JP57069774 A JP 57069774A JP 6977482 A JP6977482 A JP 6977482A JP S58186995 A JPS58186995 A JP S58186995A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductor wiring
- thick film
- integrated circuit
- film integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title description 18
- 239000004020 conductor Substances 0.000 claims description 66
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 238000010304 firing Methods 0.000 claims description 18
- 238000007639 printing Methods 0.000 claims description 12
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 29
- 239000000463 material Substances 0.000 description 25
- 239000012212 insulator Substances 0.000 description 9
- 238000001035 drying Methods 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57069774A JPS58186995A (ja) | 1982-04-26 | 1982-04-26 | 多層厚膜集積回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57069774A JPS58186995A (ja) | 1982-04-26 | 1982-04-26 | 多層厚膜集積回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58186995A true JPS58186995A (ja) | 1983-11-01 |
| JPH0213837B2 JPH0213837B2 (enrdf_load_stackoverflow) | 1990-04-05 |
Family
ID=13412464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57069774A Granted JPS58186995A (ja) | 1982-04-26 | 1982-04-26 | 多層厚膜集積回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58186995A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59181696A (ja) * | 1983-03-31 | 1984-10-16 | 富士通株式会社 | 半導体装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50143076A (enrdf_load_stackoverflow) * | 1974-05-08 | 1975-11-18 | ||
| JPS51146354U (enrdf_load_stackoverflow) * | 1975-05-19 | 1976-11-24 |
-
1982
- 1982-04-26 JP JP57069774A patent/JPS58186995A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50143076A (enrdf_load_stackoverflow) * | 1974-05-08 | 1975-11-18 | ||
| JPS51146354U (enrdf_load_stackoverflow) * | 1975-05-19 | 1976-11-24 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59181696A (ja) * | 1983-03-31 | 1984-10-16 | 富士通株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0213837B2 (enrdf_load_stackoverflow) | 1990-04-05 |
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