JPS58182896A - 印刷配線基板のはんだ付け装置 - Google Patents
印刷配線基板のはんだ付け装置Info
- Publication number
- JPS58182896A JPS58182896A JP6697682A JP6697682A JPS58182896A JP S58182896 A JPS58182896 A JP S58182896A JP 6697682 A JP6697682 A JP 6697682A JP 6697682 A JP6697682 A JP 6697682A JP S58182896 A JPS58182896 A JP S58182896A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- molten solder
- support
- support stand
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 31
- 238000012546 transfer Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 5
- 238000009736 wetting Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- -1 resistors Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6697682A JPS58182896A (ja) | 1982-04-20 | 1982-04-20 | 印刷配線基板のはんだ付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6697682A JPS58182896A (ja) | 1982-04-20 | 1982-04-20 | 印刷配線基板のはんだ付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58182896A true JPS58182896A (ja) | 1983-10-25 |
| JPS6254581B2 JPS6254581B2 (enrdf_load_stackoverflow) | 1987-11-16 |
Family
ID=13331557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6697682A Granted JPS58182896A (ja) | 1982-04-20 | 1982-04-20 | 印刷配線基板のはんだ付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58182896A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60106192A (ja) * | 1983-11-14 | 1985-06-11 | 松下電器産業株式会社 | プリント基板半田付方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5127845A (ja) * | 1974-09-03 | 1976-03-09 | Koki Kk | Handazukesochi |
-
1982
- 1982-04-20 JP JP6697682A patent/JPS58182896A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5127845A (ja) * | 1974-09-03 | 1976-03-09 | Koki Kk | Handazukesochi |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60106192A (ja) * | 1983-11-14 | 1985-06-11 | 松下電器産業株式会社 | プリント基板半田付方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6254581B2 (enrdf_load_stackoverflow) | 1987-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS648700B2 (enrdf_load_stackoverflow) | ||
| CA1263896A (en) | Wave solder finger shield apparatus | |
| JPS58182896A (ja) | 印刷配線基板のはんだ付け装置 | |
| JPH02277753A (ja) | はんだメッキ方法およびその装置 | |
| JPH02244792A (ja) | 電子部品の樹脂コーティング方法 | |
| JPS5922933Y2 (ja) | はんだ付け装置 | |
| JPH0856069A (ja) | 電気部品のはんだ付け実装構造 | |
| JPH0137825Y2 (enrdf_load_stackoverflow) | ||
| JPS60227969A (ja) | はんだ付け処理方法 | |
| JPS58162095A (ja) | 電子部品の半田付方法 | |
| JPS5961572U (ja) | 半田付装置 | |
| JPH0635498Y2 (ja) | プリント基板 | |
| JPH01157763A (ja) | 電子部品リードの予備半田付け装置 | |
| JPS6356354A (ja) | デユアルウエ−ブ半田付け装置 | |
| JPS6089965U (ja) | 半田付け装置 | |
| JPH02155567A (ja) | 噴流式はんだ槽 | |
| JPS61186163A (ja) | 半田付け装置 | |
| JPS614570A (ja) | コ−テイング液の液切り方法 | |
| JPS60130894A (ja) | 電子部品取付け方法 | |
| JPS63130259A (ja) | 自動半田づけ装置 | |
| JPS6138640B2 (enrdf_load_stackoverflow) | ||
| JPS61292992A (ja) | 壁部材を備えた印刷配線板の半田付け方法 | |
| JPS60144275U (ja) | 電子部品の交換装置 | |
| JPS61142788A (ja) | プリント基板用片面洗浄方法および装置 | |
| JPS59207688A (ja) | プリント基板の半田付方法 |