JPS58182857A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS58182857A JPS58182857A JP6659382A JP6659382A JPS58182857A JP S58182857 A JPS58182857 A JP S58182857A JP 6659382 A JP6659382 A JP 6659382A JP 6659382 A JP6659382 A JP 6659382A JP S58182857 A JPS58182857 A JP S58182857A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- pins
- lead
- semiconductor
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 239000012212 insulator Substances 0.000 claims abstract description 6
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 241000721047 Danaus plexippus Species 0.000 claims 1
- 238000005259 measurement Methods 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6659382A JPS58182857A (ja) | 1982-04-21 | 1982-04-21 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6659382A JPS58182857A (ja) | 1982-04-21 | 1982-04-21 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58182857A true JPS58182857A (ja) | 1983-10-25 |
| JPS6351544B2 JPS6351544B2 (enrdf_load_stackoverflow) | 1988-10-14 |
Family
ID=13320379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6659382A Granted JPS58182857A (ja) | 1982-04-21 | 1982-04-21 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58182857A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009133401A (ja) * | 2007-11-30 | 2009-06-18 | Nifco Inc | 可動体の支持装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0493482U (enrdf_load_stackoverflow) * | 1991-01-08 | 1992-08-13 |
-
1982
- 1982-04-21 JP JP6659382A patent/JPS58182857A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009133401A (ja) * | 2007-11-30 | 2009-06-18 | Nifco Inc | 可動体の支持装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6351544B2 (enrdf_load_stackoverflow) | 1988-10-14 |
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