JPS58182434U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58182434U
JPS58182434U JP1982080000U JP8000082U JPS58182434U JP S58182434 U JPS58182434 U JP S58182434U JP 1982080000 U JP1982080000 U JP 1982080000U JP 8000082 U JP8000082 U JP 8000082U JP S58182434 U JPS58182434 U JP S58182434U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
metal cap
heat radiator
semiconductor device
seals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982080000U
Other languages
English (en)
Other versions
JPS6233331Y2 (ja
Inventor
村竹　清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1982080000U priority Critical patent/JPS58182434U/ja
Publication of JPS58182434U publication Critical patent/JPS58182434U/ja
Application granted granted Critical
Publication of JPS6233331Y2 publication Critical patent/JPS6233331Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は両端のセラミック面に樹脂接着した放熱フィン
取付構造の従来例を示す断面図、第２図は半導体装置の
キャップ面に樹脂接着した放熱フィン取付を示す従来例
の断面図、第３図は本考案の一実施例である放熱フィン
を取付けた半導体装置を示す断面図、第４図は本考案の
一実施例である半導体装置の斜視図である。 図において、１１は半導体装置、１２は金属キャップ、
１３はセラミック基板、１４は放熱フィン、１５は接着
樹脂を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子あ収容された容器を封止するＵ字型金属キャ
    ップの端部が、放熱器に設けられた孔に挿入され、前記
    端部を折り曲けることによって前記放熱器が前記金属キ
    ャップに固定されてなることを特徴とする半導体装置。
JP1982080000U 1982-05-31 1982-05-31 半導体装置 Granted JPS58182434U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982080000U JPS58182434U (ja) 1982-05-31 1982-05-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982080000U JPS58182434U (ja) 1982-05-31 1982-05-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS58182434U true JPS58182434U (ja) 1983-12-05
JPS6233331Y2 JPS6233331Y2 (ja) 1987-08-26

Family

ID=30089159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982080000U Granted JPS58182434U (ja) 1982-05-31 1982-05-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS58182434U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005685A (ja) * 2005-06-27 2007-01-11 Fujitsu Ltd パッケージ冷却方法及び装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005685A (ja) * 2005-06-27 2007-01-11 Fujitsu Ltd パッケージ冷却方法及び装置

Also Published As

Publication number Publication date
JPS6233331Y2 (ja) 1987-08-26

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