JPS58180026A - ウエハ研磨用吸着板 - Google Patents

ウエハ研磨用吸着板

Info

Publication number
JPS58180026A
JPS58180026A JP6182082A JP6182082A JPS58180026A JP S58180026 A JPS58180026 A JP S58180026A JP 6182082 A JP6182082 A JP 6182082A JP 6182082 A JP6182082 A JP 6182082A JP S58180026 A JPS58180026 A JP S58180026A
Authority
JP
Japan
Prior art keywords
wafer
elastic body
attracting board
suction
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6182082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS634937B2 (enrdf_load_stackoverflow
Inventor
Junji Watanabe
純二 渡辺
Toshiro Karaki
俊郎 唐木
Kenkichi Tsuruta
鶴田　兼吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP6182082A priority Critical patent/JPS58180026A/ja
Publication of JPS58180026A publication Critical patent/JPS58180026A/ja
Publication of JPS634937B2 publication Critical patent/JPS634937B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP6182082A 1982-04-15 1982-04-15 ウエハ研磨用吸着板 Granted JPS58180026A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6182082A JPS58180026A (ja) 1982-04-15 1982-04-15 ウエハ研磨用吸着板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6182082A JPS58180026A (ja) 1982-04-15 1982-04-15 ウエハ研磨用吸着板

Publications (2)

Publication Number Publication Date
JPS58180026A true JPS58180026A (ja) 1983-10-21
JPS634937B2 JPS634937B2 (enrdf_load_stackoverflow) 1988-02-01

Family

ID=13182097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6182082A Granted JPS58180026A (ja) 1982-04-15 1982-04-15 ウエハ研磨用吸着板

Country Status (1)

Country Link
JP (1) JPS58180026A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60221233A (ja) * 1984-04-16 1985-11-05 Nitto Electric Ind Co Ltd 半導体ウエハの表面保護方法
US4597228A (en) * 1983-12-19 1986-07-01 Citizen Watch Co., Ltd. Vacuum suction device
JPS61182738A (ja) * 1985-02-07 1986-08-15 Shibayama Kikai Kk ウエハのフリ−サイズチヤツク機構
US6399498B1 (en) 1998-02-05 2002-06-04 Shin-Etsu Handotai Co., Ltd. Method and apparatus for polishing work
CN102962735A (zh) * 2012-11-30 2013-03-13 烟台鑫海矿山机械有限公司 一种橡胶板打磨装置
JP2015037137A (ja) * 2013-08-14 2015-02-23 株式会社ディスコ チャックテーブル

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55149949A (en) * 1979-05-14 1980-11-21 Fuji Electric Co Ltd Separation of selenium material from selenium photoreceptor
JPS56153741A (en) * 1980-04-30 1981-11-27 Toshiba Corp Supporting device for semiconductor wafer
JPS5934142U (ja) * 1982-08-27 1984-03-02 株式会社オ−デイオテクニカ 振動吸収装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55149949A (en) * 1979-05-14 1980-11-21 Fuji Electric Co Ltd Separation of selenium material from selenium photoreceptor
JPS56153741A (en) * 1980-04-30 1981-11-27 Toshiba Corp Supporting device for semiconductor wafer
JPS5934142U (ja) * 1982-08-27 1984-03-02 株式会社オ−デイオテクニカ 振動吸収装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4597228A (en) * 1983-12-19 1986-07-01 Citizen Watch Co., Ltd. Vacuum suction device
JPS60221233A (ja) * 1984-04-16 1985-11-05 Nitto Electric Ind Co Ltd 半導体ウエハの表面保護方法
JPS61182738A (ja) * 1985-02-07 1986-08-15 Shibayama Kikai Kk ウエハのフリ−サイズチヤツク機構
US6399498B1 (en) 1998-02-05 2002-06-04 Shin-Etsu Handotai Co., Ltd. Method and apparatus for polishing work
CN102962735A (zh) * 2012-11-30 2013-03-13 烟台鑫海矿山机械有限公司 一种橡胶板打磨装置
JP2015037137A (ja) * 2013-08-14 2015-02-23 株式会社ディスコ チャックテーブル

Also Published As

Publication number Publication date
JPS634937B2 (enrdf_load_stackoverflow) 1988-02-01

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