JPS58178593A - プリント基板の半田付け方法及び装置 - Google Patents

プリント基板の半田付け方法及び装置

Info

Publication number
JPS58178593A
JPS58178593A JP6207882A JP6207882A JPS58178593A JP S58178593 A JPS58178593 A JP S58178593A JP 6207882 A JP6207882 A JP 6207882A JP 6207882 A JP6207882 A JP 6207882A JP S58178593 A JPS58178593 A JP S58178593A
Authority
JP
Japan
Prior art keywords
soldering
solder
printed circuit
circuit board
molten solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6207882A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0373156B2 (enrdf_load_stackoverflow
Inventor
八治 横田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOKOTA KIKAI KK
Original Assignee
YOKOTA KIKAI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOKOTA KIKAI KK filed Critical YOKOTA KIKAI KK
Priority to JP6207882A priority Critical patent/JPS58178593A/ja
Publication of JPS58178593A publication Critical patent/JPS58178593A/ja
Publication of JPH0373156B2 publication Critical patent/JPH0373156B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
JP6207882A 1982-04-13 1982-04-13 プリント基板の半田付け方法及び装置 Granted JPS58178593A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6207882A JPS58178593A (ja) 1982-04-13 1982-04-13 プリント基板の半田付け方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6207882A JPS58178593A (ja) 1982-04-13 1982-04-13 プリント基板の半田付け方法及び装置

Publications (2)

Publication Number Publication Date
JPS58178593A true JPS58178593A (ja) 1983-10-19
JPH0373156B2 JPH0373156B2 (enrdf_load_stackoverflow) 1991-11-20

Family

ID=13189670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6207882A Granted JPS58178593A (ja) 1982-04-13 1982-04-13 プリント基板の半田付け方法及び装置

Country Status (1)

Country Link
JP (1) JPS58178593A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6513702B2 (en) 2000-10-23 2003-02-04 Senju Metal Industry Co., Ltd. Automatic wave soldering apparatus and method
JP2006342950A (ja) * 2005-06-07 2006-12-21 Hiroyuki Imoto スピードカバー

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7538473B2 (en) 2004-02-03 2009-05-26 S.C. Johnson & Son, Inc. Drive circuits and methods for ultrasonic piezoelectric actuators

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57112094A (en) * 1980-12-29 1982-07-12 Alps Electric Co Ltd Soldering device
JPS57199298A (en) * 1981-06-02 1982-12-07 Kondo Kenji Jet stream type soldering tank

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57112094A (en) * 1980-12-29 1982-07-12 Alps Electric Co Ltd Soldering device
JPS57199298A (en) * 1981-06-02 1982-12-07 Kondo Kenji Jet stream type soldering tank

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6513702B2 (en) 2000-10-23 2003-02-04 Senju Metal Industry Co., Ltd. Automatic wave soldering apparatus and method
JP2006342950A (ja) * 2005-06-07 2006-12-21 Hiroyuki Imoto スピードカバー

Also Published As

Publication number Publication date
JPH0373156B2 (enrdf_load_stackoverflow) 1991-11-20

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