JPS58176958A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58176958A
JPS58176958A JP57059953A JP5995382A JPS58176958A JP S58176958 A JPS58176958 A JP S58176958A JP 57059953 A JP57059953 A JP 57059953A JP 5995382 A JP5995382 A JP 5995382A JP S58176958 A JPS58176958 A JP S58176958A
Authority
JP
Japan
Prior art keywords
epoxy resin
carboxyl group
semiconductor device
curing agent
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57059953A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6258665B2 (enrdf_load_stackoverflow
Inventor
Toku Nagasawa
徳 長沢
Saburo Omori
大森　三郎
Eiji Kihira
紀平　栄嗣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP57059953A priority Critical patent/JPS58176958A/ja
Publication of JPS58176958A publication Critical patent/JPS58176958A/ja
Publication of JPS6258665B2 publication Critical patent/JPS6258665B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57059953A 1982-04-09 1982-04-09 半導体装置 Granted JPS58176958A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57059953A JPS58176958A (ja) 1982-04-09 1982-04-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57059953A JPS58176958A (ja) 1982-04-09 1982-04-09 半導体装置

Publications (2)

Publication Number Publication Date
JPS58176958A true JPS58176958A (ja) 1983-10-17
JPS6258665B2 JPS6258665B2 (enrdf_load_stackoverflow) 1987-12-07

Family

ID=13128012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57059953A Granted JPS58176958A (ja) 1982-04-09 1982-04-09 半導体装置

Country Status (1)

Country Link
JP (1) JPS58176958A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6068066A (ja) * 1982-10-15 1985-04-18 アイエフエム　デベロツプメント　アクチ−ボラグ 噴射ランス用ノズル
JPS60248769A (ja) * 1984-04-25 1985-12-09 Matsushita Electric Works Ltd Ｉｃ封止用樹脂組成物
JPS614721A (ja) * 1984-06-19 1986-01-10 Sumitomo Chem Co Ltd エポキシ樹脂組成物
US4829124A (en) * 1986-11-17 1989-05-09 Armstrong World Industries, Inc. Dynamically crosslinked thermoplastic elastomer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58121653A (ja) * 1982-01-12 1983-07-20 Hitachi Ltd 半導体装置封止用エポキシ樹脂組成物とその製法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58121653A (ja) * 1982-01-12 1983-07-20 Hitachi Ltd 半導体装置封止用エポキシ樹脂組成物とその製法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6068066A (ja) * 1982-10-15 1985-04-18 アイエフエム　デベロツプメント　アクチ−ボラグ 噴射ランス用ノズル
JPS60248769A (ja) * 1984-04-25 1985-12-09 Matsushita Electric Works Ltd Ｉｃ封止用樹脂組成物
JPS614721A (ja) * 1984-06-19 1986-01-10 Sumitomo Chem Co Ltd エポキシ樹脂組成物
US4829124A (en) * 1986-11-17 1989-05-09 Armstrong World Industries, Inc. Dynamically crosslinked thermoplastic elastomer

Also Published As

Publication number Publication date
JPS6258665B2 (enrdf_load_stackoverflow) 1987-12-07

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