JPH0320068B2 - - Google Patents
Info
- Publication number
- JPH0320068B2 JPH0320068B2 JP60001927A JP192785A JPH0320068B2 JP H0320068 B2 JPH0320068 B2 JP H0320068B2 JP 60001927 A JP60001927 A JP 60001927A JP 192785 A JP192785 A JP 192785A JP H0320068 B2 JPH0320068 B2 JP H0320068B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- semiconductor device
- powder
- curing agent
- organosilicon powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60001927A JPS61160955A (ja) | 1985-01-09 | 1985-01-09 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60001927A JPS61160955A (ja) | 1985-01-09 | 1985-01-09 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4584794A Division JPH0770408A (ja) | 1994-03-16 | 1994-03-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61160955A JPS61160955A (ja) | 1986-07-21 |
| JPH0320068B2 true JPH0320068B2 (enrdf_load_stackoverflow) | 1991-03-18 |
Family
ID=11515232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60001927A Granted JPS61160955A (ja) | 1985-01-09 | 1985-01-09 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61160955A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2585384B2 (ja) * | 1988-07-28 | 1997-02-26 | 東芝シリコーン株式会社 | 封止用樹脂組成物 |
| US20230407082A1 (en) | 2020-11-27 | 2023-12-21 | Shin-Etsu Chemical Co., Ltd. | Heat-curable resin composition |
-
1985
- 1985-01-09 JP JP60001927A patent/JPS61160955A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61160955A (ja) | 1986-07-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |