JPS61160955A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS61160955A
JPS61160955A JP60001927A JP192785A JPS61160955A JP S61160955 A JPS61160955 A JP S61160955A JP 60001927 A JP60001927 A JP 60001927A JP 192785 A JP192785 A JP 192785A JP S61160955 A JPS61160955 A JP S61160955A
Authority
JP
Japan
Prior art keywords
semiconductor device
epoxy resin
powder
organosilicon powder
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60001927A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0320068B2 (enrdf_load_stackoverflow
Inventor
Toku Nagasawa
徳 長沢
Kazuyuki Kuwata
和幸 桑田
Hideto Kimura
英人 木村
Kazuo Iko
伊香　和夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP60001927A priority Critical patent/JPS61160955A/ja
Publication of JPS61160955A publication Critical patent/JPS61160955A/ja
Publication of JPH0320068B2 publication Critical patent/JPH0320068B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60001927A 1985-01-09 1985-01-09 半導体装置 Granted JPS61160955A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60001927A JPS61160955A (ja) 1985-01-09 1985-01-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60001927A JPS61160955A (ja) 1985-01-09 1985-01-09 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP4584794A Division JPH0770408A (ja) 1994-03-16 1994-03-16 半導体装置

Publications (2)

Publication Number Publication Date
JPS61160955A true JPS61160955A (ja) 1986-07-21
JPH0320068B2 JPH0320068B2 (enrdf_load_stackoverflow) 1991-03-18

Family

ID=11515232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60001927A Granted JPS61160955A (ja) 1985-01-09 1985-01-09 半導体装置

Country Status (1)

Country Link
JP (1) JPS61160955A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0238417A (ja) * 1988-07-28 1990-02-07 Toshiba Silicone Co Ltd 封止用樹脂組成物
WO2022113892A1 (ja) 2020-11-27 2022-06-02 信越化学工業株式会社 熱硬化性樹脂組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0238417A (ja) * 1988-07-28 1990-02-07 Toshiba Silicone Co Ltd 封止用樹脂組成物
WO2022113892A1 (ja) 2020-11-27 2022-06-02 信越化学工業株式会社 熱硬化性樹脂組成物
KR20230110777A (ko) 2020-11-27 2023-07-25 신에쓰 가가꾸 고교 가부시끼가이샤 열경화성 수지 조성물

Also Published As

Publication number Publication date
JPH0320068B2 (enrdf_load_stackoverflow) 1991-03-18

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term