JPH0330615B2 - - Google Patents

Info

Publication number
JPH0330615B2
JPH0330615B2 JP58144466A JP14446683A JPH0330615B2 JP H0330615 B2 JPH0330615 B2 JP H0330615B2 JP 58144466 A JP58144466 A JP 58144466A JP 14446683 A JP14446683 A JP 14446683A JP H0330615 B2 JPH0330615 B2 JP H0330615B2
Authority
JP
Japan
Prior art keywords
resin
epoxy
group
molecule
type phenolic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58144466A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6036527A (ja
Inventor
Masayuki Kochama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Original Assignee
Toshiba Chemical Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd
Priority to JP14446683A priority Critical patent/JPS6036527A/ja
Publication of JPS6036527A publication Critical patent/JPS6036527A/ja
Publication of JPH0330615B2 publication Critical patent/JPH0330615B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP14446683A 1983-08-09 1983-08-09 封止用樹脂組成物 Granted JPS6036527A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14446683A JPS6036527A (ja) 1983-08-09 1983-08-09 封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14446683A JPS6036527A (ja) 1983-08-09 1983-08-09 封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6036527A JPS6036527A (ja) 1985-02-25
JPH0330615B2 true JPH0330615B2 (enrdf_load_stackoverflow) 1991-05-01

Family

ID=15362928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14446683A Granted JPS6036527A (ja) 1983-08-09 1983-08-09 封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6036527A (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61285215A (ja) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd 電子部品用成形材料
JPH01185350A (ja) * 1988-01-18 1989-07-24 Matsushita Electric Works Ltd エポキシ樹脂成形材料
JP2657299B2 (ja) * 1988-03-31 1997-09-24 東芝ケミカル株式会社 封止用樹脂組成物およびその製造方法
JP2657989B2 (ja) * 1988-03-31 1997-09-30 東芝ケミカル株式会社 封止用樹脂組成物およびその製造方法
JPH0776258B2 (ja) * 1988-09-29 1995-08-16 日東電工株式会社 半導体装置
JPH0776257B2 (ja) * 1988-09-29 1995-08-16 日東電工株式会社 半導体装置
JPH02123758A (ja) * 1988-11-02 1990-05-11 Nitto Denko Corp 半導体装置
JPH04209622A (ja) * 1990-11-30 1992-07-31 Matsushita Electric Works Ltd エポキシ樹脂組成物
US6051642A (en) 1997-09-15 2000-04-18 General Electric Company Silicone composition with improved high temperature tolerance

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56136816A (en) * 1980-03-31 1981-10-26 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS57131223A (en) * 1981-02-06 1982-08-14 Hitachi Ltd Resin composition
JPS58108220A (ja) * 1981-12-21 1983-06-28 Mitsubishi Gas Chem Co Inc 半導体封止用エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS6036527A (ja) 1985-02-25

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