JPS6036527A - 封止用樹脂組成物 - Google Patents
封止用樹脂組成物Info
- Publication number
- JPS6036527A JPS6036527A JP14446683A JP14446683A JPS6036527A JP S6036527 A JPS6036527 A JP S6036527A JP 14446683 A JP14446683 A JP 14446683A JP 14446683 A JP14446683 A JP 14446683A JP S6036527 A JPS6036527 A JP S6036527A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- group
- epoxy
- resin composition
- novolak
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims description 13
- 238000007789 sealing Methods 0.000 title claims description 13
- 229920003051 synthetic elastomer Polymers 0.000 claims abstract description 14
- 239000005061 synthetic rubber Substances 0.000 claims abstract description 14
- 229920003986 novolac Polymers 0.000 claims abstract description 11
- 239000004593 Epoxy Substances 0.000 claims abstract description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 abstract description 15
- 229920001568 phenolic resin Polymers 0.000 abstract description 12
- 239000004065 semiconductor Substances 0.000 abstract description 11
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 10
- 239000003822 epoxy resin Substances 0.000 abstract description 8
- 239000008188 pellet Substances 0.000 abstract description 8
- 229920000647 polyepoxide Polymers 0.000 abstract description 8
- -1 amino, carboxyl Chemical group 0.000 abstract description 6
- 125000003700 epoxy group Chemical group 0.000 abstract description 6
- 239000000203 mixture Substances 0.000 abstract description 6
- 239000011256 inorganic filler Substances 0.000 abstract description 5
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000005062 Polybutadiene Substances 0.000 abstract description 3
- 125000004093 cyano group Chemical group *C#N 0.000 abstract description 3
- 229920002857 polybutadiene Polymers 0.000 abstract description 3
- 229920001296 polysiloxane Polymers 0.000 abstract description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract 1
- 229930003836 cresol Natural products 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 239000000843 powder Substances 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 229920000459 Nitrile rubber Polymers 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 239000012778 molding material Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 244000082204 Phyllostachys viridis Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 244000000231 Sesamum indicum Species 0.000 description 1
- 235000003434 Sesamum indicum Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000005480 straight-chain fatty acid group Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14446683A JPS6036527A (ja) | 1983-08-09 | 1983-08-09 | 封止用樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14446683A JPS6036527A (ja) | 1983-08-09 | 1983-08-09 | 封止用樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6036527A true JPS6036527A (ja) | 1985-02-25 |
| JPH0330615B2 JPH0330615B2 (enrdf_load_stackoverflow) | 1991-05-01 |
Family
ID=15362928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14446683A Granted JPS6036527A (ja) | 1983-08-09 | 1983-08-09 | 封止用樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6036527A (enrdf_load_stackoverflow) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61285215A (ja) * | 1985-06-13 | 1986-12-16 | Matsushita Electric Works Ltd | 電子部品用成形材料 |
| JPH01185350A (ja) * | 1988-01-18 | 1989-07-24 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
| JPH01249854A (ja) * | 1988-03-31 | 1989-10-05 | Toshiba Chem Corp | 封止用樹脂組成物およびその製造方法 |
| JPH01249825A (ja) * | 1988-03-31 | 1989-10-05 | Toshiba Chem Corp | 封止用樹脂組成物およびその製造方法 |
| JPH0291965A (ja) * | 1988-09-29 | 1990-03-30 | Nitto Denko Corp | 半導体装置 |
| JPH0291966A (ja) * | 1988-09-29 | 1990-03-30 | Nitto Denko Corp | 半導体装置 |
| JPH02123758A (ja) * | 1988-11-02 | 1990-05-11 | Nitto Denko Corp | 半導体装置 |
| JPH04209622A (ja) * | 1990-11-30 | 1992-07-31 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
| US6051642A (en) * | 1997-09-15 | 2000-04-18 | General Electric Company | Silicone composition with improved high temperature tolerance |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56136816A (en) * | 1980-03-31 | 1981-10-26 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
| JPS57131223A (en) * | 1981-02-06 | 1982-08-14 | Hitachi Ltd | Resin composition |
| JPS58108220A (ja) * | 1981-12-21 | 1983-06-28 | Mitsubishi Gas Chem Co Inc | 半導体封止用エポキシ樹脂組成物 |
-
1983
- 1983-08-09 JP JP14446683A patent/JPS6036527A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56136816A (en) * | 1980-03-31 | 1981-10-26 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
| JPS57131223A (en) * | 1981-02-06 | 1982-08-14 | Hitachi Ltd | Resin composition |
| JPS58108220A (ja) * | 1981-12-21 | 1983-06-28 | Mitsubishi Gas Chem Co Inc | 半導体封止用エポキシ樹脂組成物 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61285215A (ja) * | 1985-06-13 | 1986-12-16 | Matsushita Electric Works Ltd | 電子部品用成形材料 |
| JPH01185350A (ja) * | 1988-01-18 | 1989-07-24 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
| JPH01249854A (ja) * | 1988-03-31 | 1989-10-05 | Toshiba Chem Corp | 封止用樹脂組成物およびその製造方法 |
| JPH01249825A (ja) * | 1988-03-31 | 1989-10-05 | Toshiba Chem Corp | 封止用樹脂組成物およびその製造方法 |
| JPH0291965A (ja) * | 1988-09-29 | 1990-03-30 | Nitto Denko Corp | 半導体装置 |
| JPH0291966A (ja) * | 1988-09-29 | 1990-03-30 | Nitto Denko Corp | 半導体装置 |
| JPH02123758A (ja) * | 1988-11-02 | 1990-05-11 | Nitto Denko Corp | 半導体装置 |
| JPH04209622A (ja) * | 1990-11-30 | 1992-07-31 | Matsushita Electric Works Ltd | エポキシ樹脂組成物 |
| US6051642A (en) * | 1997-09-15 | 2000-04-18 | General Electric Company | Silicone composition with improved high temperature tolerance |
| US6395815B1 (en) | 1997-09-15 | 2002-05-28 | General Electric Company | Silicone composition with improved high temperature tolerance |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0330615B2 (enrdf_load_stackoverflow) | 1991-05-01 |
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