JPS58173249U - 高圧ダイオ−ド - Google Patents

高圧ダイオ−ド

Info

Publication number
JPS58173249U
JPS58173249U JP1982069197U JP6919782U JPS58173249U JP S58173249 U JPS58173249 U JP S58173249U JP 1982069197 U JP1982069197 U JP 1982069197U JP 6919782 U JP6919782 U JP 6919782U JP S58173249 U JPS58173249 U JP S58173249U
Authority
JP
Japan
Prior art keywords
voltage diode
high voltage
abstract
mesa
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982069197U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0249732Y2 (enrdf_load_stackoverflow
Inventor
小玉　敏昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1982069197U priority Critical patent/JPS58173249U/ja
Publication of JPS58173249U publication Critical patent/JPS58173249U/ja
Application granted granted Critical
Publication of JPH0249732Y2 publication Critical patent/JPH0249732Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
JP1982069197U 1982-05-12 1982-05-12 高圧ダイオ−ド Granted JPS58173249U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982069197U JPS58173249U (ja) 1982-05-12 1982-05-12 高圧ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982069197U JPS58173249U (ja) 1982-05-12 1982-05-12 高圧ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS58173249U true JPS58173249U (ja) 1983-11-19
JPH0249732Y2 JPH0249732Y2 (enrdf_load_stackoverflow) 1990-12-27

Family

ID=30078934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982069197U Granted JPS58173249U (ja) 1982-05-12 1982-05-12 高圧ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS58173249U (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011210805A (ja) * 2010-03-29 2011-10-20 Shindengen Electric Mfg Co Ltd ダイオードモジュール及び保護用デバイス
JP2013093574A (ja) * 2011-10-26 2013-05-16 General Electric Co <Ge> 過渡電圧抑制器のための方法およびシステム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4995585A (enrdf_load_stackoverflow) * 1973-01-12 1974-09-10
JPS51134579A (en) * 1975-05-16 1976-11-22 Mitsubishi Electric Corp Semiconductor device
JPS5227033A (en) * 1975-08-26 1977-03-01 Katayama Chemical Works Co Anticorrosive for condensed water in circulation system
JPS5327370A (en) * 1976-08-24 1978-03-14 Rca Corp Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4995585A (enrdf_load_stackoverflow) * 1973-01-12 1974-09-10
JPS51134579A (en) * 1975-05-16 1976-11-22 Mitsubishi Electric Corp Semiconductor device
JPS5227033A (en) * 1975-08-26 1977-03-01 Katayama Chemical Works Co Anticorrosive for condensed water in circulation system
JPS5327370A (en) * 1976-08-24 1978-03-14 Rca Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011210805A (ja) * 2010-03-29 2011-10-20 Shindengen Electric Mfg Co Ltd ダイオードモジュール及び保護用デバイス
JP2013093574A (ja) * 2011-10-26 2013-05-16 General Electric Co <Ge> 過渡電圧抑制器のための方法およびシステム

Also Published As

Publication number Publication date
JPH0249732Y2 (enrdf_load_stackoverflow) 1990-12-27

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