JPS58168266A - 金層の選択的付着方法 - Google Patents

金層の選択的付着方法

Info

Publication number
JPS58168266A
JPS58168266A JP58010026A JP1002683A JPS58168266A JP S58168266 A JPS58168266 A JP S58168266A JP 58010026 A JP58010026 A JP 58010026A JP 1002683 A JP1002683 A JP 1002683A JP S58168266 A JPS58168266 A JP S58168266A
Authority
JP
Japan
Prior art keywords
substrate
metal
pattern
copper
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58010026A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6317337B2 (cg-RX-API-DMAC10.html
Inventor
アナンダ・ホサケア・クマ−ル
クリス・ペンカトラマン・スリクリシユナン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS58168266A publication Critical patent/JPS58168266A/ja
Publication of JPS6317337B2 publication Critical patent/JPS6317337B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W99/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP58010026A 1982-03-18 1983-01-26 金層の選択的付着方法 Granted JPS58168266A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US359469 1982-03-18
US06/359,469 US4493856A (en) 1982-03-18 1982-03-18 Selective coating of metallurgical features of a dielectric substrate with diverse metals

Publications (2)

Publication Number Publication Date
JPS58168266A true JPS58168266A (ja) 1983-10-04
JPS6317337B2 JPS6317337B2 (cg-RX-API-DMAC10.html) 1988-04-13

Family

ID=23413928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58010026A Granted JPS58168266A (ja) 1982-03-18 1983-01-26 金層の選択的付着方法

Country Status (2)

Country Link
US (1) US4493856A (cg-RX-API-DMAC10.html)
JP (1) JPS58168266A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007000615A (ja) * 2005-05-27 2007-01-11 Itoki Corp 学習家具における仕切板の取付装置

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4582722A (en) * 1984-10-30 1986-04-15 International Business Machines Corporation Diffusion isolation layer for maskless cladding process
US4663186A (en) * 1986-04-24 1987-05-05 International Business Machines Corporation Screenable paste for use as a barrier layer on a substrate during maskless cladding
US4704304A (en) * 1986-10-27 1987-11-03 International Business Machines Corporation Method for repair of opens in thin film lines on a substrate
US4829020A (en) * 1987-10-23 1989-05-09 The United States Of America As Represented By The United States Department Of Energy Substrate solder barriers for semiconductor epilayer growth
US4934309A (en) * 1988-04-15 1990-06-19 International Business Machines Corporation Solder deposition system
US4898117A (en) * 1988-04-15 1990-02-06 International Business Machines Corporation Solder deposition system
DE3907004A1 (de) * 1989-03-04 1990-09-06 Contraves Ag Verfahren zum herstellen von duennschichtschaltungen
EP0421120B1 (en) * 1989-10-05 1996-10-30 International Business Machines Corporation Thin film magnetic storage medium and method for the manufacture thereof
US5156903A (en) * 1989-12-21 1992-10-20 Sumitomo Metal Ceramics Inc. Multilayer ceramic substrate and manufacture thereof
US5104689A (en) * 1990-09-24 1992-04-14 International Business Machines Corporation Method and apparatus for automated solder deposition at multiple sites
US5143867A (en) * 1991-02-13 1992-09-01 International Business Machines Corporation Method for depositing interconnection metallurgy using low temperature alloy processes
US5719447A (en) 1993-06-03 1998-02-17 Intel Corporation Metal alloy interconnections for integrated circuits
US6066514A (en) * 1996-10-18 2000-05-23 Micron Technology, Inc. Adhesion enhanced semiconductor die for mold compound packaging
US5787578A (en) * 1996-07-09 1998-08-04 International Business Machines Corporation Method of selectively depositing a metallic layer on a ceramic substrate
US6376054B1 (en) * 1999-02-10 2002-04-23 International Business Machines Corporation Surface metallization structure for multiple chip test and burn-in
DE19909505C2 (de) * 1999-03-04 2001-11-15 Daimler Chrysler Ag Verfahren zur Herstellung von Schaltungsanordnungen
US20020076910A1 (en) * 1999-12-15 2002-06-20 Pace Benedict G. High density electronic interconnection
DE10101359A1 (de) * 2001-01-13 2002-07-25 Conti Temic Microelectronic Verfahren zur Herstellung einer elektronischen Baugruppe
KR101159514B1 (ko) 2007-05-24 2012-06-26 프린코 코포레이션 다층기판 금속배선 제조방법 및 그 구조
TWI354523B (en) * 2007-05-25 2011-12-11 Princo Corp Method for manufacturing metal lines in multi-laye
US8815333B2 (en) 2007-12-05 2014-08-26 Princo Middle East Fze Manufacturing method of metal structure in multi-layer substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3186863A (en) * 1961-06-05 1965-06-01 Hughes Aircraft Co Process for plating ceramic bodies
US3512051A (en) * 1965-12-29 1970-05-12 Burroughs Corp Contacts for a semiconductor device
DE1627596A1 (de) * 1967-02-24 1971-07-15 Siemens Ag Verfahren zum Verzinnen und/oder Verloeten von metallischen Stellen,insbesondere der Leiterbahnen von Schaltungsplatten der Fernmeldetechnik
NL6914593A (cg-RX-API-DMAC10.html) * 1969-09-26 1971-03-30
US3736167A (en) * 1971-04-01 1973-05-29 Coors Porcelain Co Electroless nickel plating process
US3698408A (en) * 1971-06-11 1972-10-17 Branson Instr Ultrasonic processing apparatus
US3979858A (en) * 1975-07-24 1976-09-14 International Lead Zinc Research Organization, Inc. Chemically accelerated metal finishing process
US4206254A (en) * 1979-02-28 1980-06-03 International Business Machines Corporation Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007000615A (ja) * 2005-05-27 2007-01-11 Itoki Corp 学習家具における仕切板の取付装置

Also Published As

Publication number Publication date
JPS6317337B2 (cg-RX-API-DMAC10.html) 1988-04-13
US4493856A (en) 1985-01-15

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