JPS58164250A - 半導体封止用樹脂組成物 - Google Patents

半導体封止用樹脂組成物

Info

Publication number
JPS58164250A
JPS58164250A JP57046611A JP4661182A JPS58164250A JP S58164250 A JPS58164250 A JP S58164250A JP 57046611 A JP57046611 A JP 57046611A JP 4661182 A JP4661182 A JP 4661182A JP S58164250 A JPS58164250 A JP S58164250A
Authority
JP
Japan
Prior art keywords
weight
resin composition
semiconductor encapsulation
less
silica powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57046611A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0343784B2 (enrdf_load_stackoverflow
Inventor
Kazuyuki Miki
三木　和幸
Takeo Ono
大野　武男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP57046611A priority Critical patent/JPS58164250A/ja
Publication of JPS58164250A publication Critical patent/JPS58164250A/ja
Publication of JPH0343784B2 publication Critical patent/JPH0343784B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57046611A 1982-03-24 1982-03-24 半導体封止用樹脂組成物 Granted JPS58164250A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57046611A JPS58164250A (ja) 1982-03-24 1982-03-24 半導体封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57046611A JPS58164250A (ja) 1982-03-24 1982-03-24 半導体封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS58164250A true JPS58164250A (ja) 1983-09-29
JPH0343784B2 JPH0343784B2 (enrdf_load_stackoverflow) 1991-07-03

Family

ID=12752093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57046611A Granted JPS58164250A (ja) 1982-03-24 1982-03-24 半導体封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS58164250A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181422A (ja) * 1984-09-28 1986-04-25 Toshiba Corp 注型用エポキシ樹脂組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181422A (ja) * 1984-09-28 1986-04-25 Toshiba Corp 注型用エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPH0343784B2 (enrdf_load_stackoverflow) 1991-07-03

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