JPS58161392A - 絶縁基板の導体パタ−ン形成方法 - Google Patents
絶縁基板の導体パタ−ン形成方法Info
- Publication number
- JPS58161392A JPS58161392A JP4402582A JP4402582A JPS58161392A JP S58161392 A JPS58161392 A JP S58161392A JP 4402582 A JP4402582 A JP 4402582A JP 4402582 A JP4402582 A JP 4402582A JP S58161392 A JPS58161392 A JP S58161392A
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- conductor
- insulating substrate
- pattern
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electronic Switches (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4402582A JPS58161392A (ja) | 1982-03-18 | 1982-03-18 | 絶縁基板の導体パタ−ン形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4402582A JPS58161392A (ja) | 1982-03-18 | 1982-03-18 | 絶縁基板の導体パタ−ン形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58161392A true JPS58161392A (ja) | 1983-09-24 |
JPS6358396B2 JPS6358396B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-11-15 |
Family
ID=12680110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4402582A Granted JPS58161392A (ja) | 1982-03-18 | 1982-03-18 | 絶縁基板の導体パタ−ン形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58161392A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5262656A (en) * | 1975-11-20 | 1977-05-24 | Oki Electric Ind Co Ltd | Method of producing integrated circuit |
-
1982
- 1982-03-18 JP JP4402582A patent/JPS58161392A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5262656A (en) * | 1975-11-20 | 1977-05-24 | Oki Electric Ind Co Ltd | Method of producing integrated circuit |
Also Published As
Publication number | Publication date |
---|---|
JPS6358396B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-11-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS58161392A (ja) | 絶縁基板の導体パタ−ン形成方法 | |
JP4135890B2 (ja) | フラットフレキシブルケーブルの耐熱性回路基板に対する半田接続方法 | |
JPH10321651A (ja) | 半導体装置 | |
JP2571833B2 (ja) | 表面実装部品のリードの半田付け方法 | |
JP2924113B2 (ja) | 電子部品のボンディング方法 | |
JPS61231797A (ja) | 小型電子部品取付方法 | |
JPS6027101A (ja) | 多連チツプ抵抗器 | |
JPS6237738Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPS61198740A (ja) | 厚膜回路基板 | |
JPS6339969Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPS58162093A (ja) | 絶縁基板の導体パタ−ン形成方法 | |
JPH0225251Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPS5810367Y2 (ja) | 混成集積回路 | |
JPS60111496A (ja) | 電気回路装置 | |
JPH03246988A (ja) | 混成集積回路 | |
JPS592865A (ja) | ドライバ搭載型サ−マルヘツド | |
JPH06218969A (ja) | サーマルヘッド基板 | |
JPH03109374U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPH03196692A (ja) | Icリード半田付け用のパッド | |
JPH0298187A (ja) | 厚膜集積回路およびその製造方法 | |
JPS58102533A (ja) | 混成集積回路装置の製造方法 | |
JPS6341741B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPS6196797A (ja) | 厚膜hic多層基板の製造方法 | |
JPS61150398A (ja) | フラツトパツケ−ジの半田付け方法およびそのためのマスク板 | |
JPS6286792A (ja) | 混成集積回路 |