JPS58154250A - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS58154250A
JPS58154250A JP57037444A JP3744482A JPS58154250A JP S58154250 A JPS58154250 A JP S58154250A JP 57037444 A JP57037444 A JP 57037444A JP 3744482 A JP3744482 A JP 3744482A JP S58154250 A JPS58154250 A JP S58154250A
Authority
JP
Japan
Prior art keywords
hybrid integrated
integrated circuit
backing material
board
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57037444A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0354469B2 (enExample
Inventor
Yoshio Miura
三浦　敬男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP57037444A priority Critical patent/JPS58154250A/ja
Publication of JPS58154250A publication Critical patent/JPS58154250A/ja
Publication of JPH0354469B2 publication Critical patent/JPH0354469B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Casings For Electric Apparatus (AREA)
JP57037444A 1982-03-09 1982-03-09 混成集積回路 Granted JPS58154250A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57037444A JPS58154250A (ja) 1982-03-09 1982-03-09 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57037444A JPS58154250A (ja) 1982-03-09 1982-03-09 混成集積回路

Publications (2)

Publication Number Publication Date
JPS58154250A true JPS58154250A (ja) 1983-09-13
JPH0354469B2 JPH0354469B2 (enExample) 1991-08-20

Family

ID=12497670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57037444A Granted JPS58154250A (ja) 1982-03-09 1982-03-09 混成集積回路

Country Status (1)

Country Link
JP (1) JPS58154250A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008019087A (ja) * 2006-07-14 2008-01-31 Mitsubishi Heavy Ind Ltd ウェブ折り畳み装置及び輪転印刷機
FR2957192A1 (fr) * 2010-03-03 2011-09-09 Hispano Suiza Sa Module electronique de puissance pour un actionneur pour aeronef
CN102915976A (zh) * 2012-10-08 2013-02-06 华东光电集成器件研究所 一种耐高过载的集成电路

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008019087A (ja) * 2006-07-14 2008-01-31 Mitsubishi Heavy Ind Ltd ウェブ折り畳み装置及び輪転印刷機
FR2957192A1 (fr) * 2010-03-03 2011-09-09 Hispano Suiza Sa Module electronique de puissance pour un actionneur pour aeronef
CN102915976A (zh) * 2012-10-08 2013-02-06 华东光电集成器件研究所 一种耐高过载的集成电路

Also Published As

Publication number Publication date
JPH0354469B2 (enExample) 1991-08-20

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