JPS58147142A - 半導体機器のリ−ド材用銅合金 - Google Patents

半導体機器のリ−ド材用銅合金

Info

Publication number
JPS58147142A
JPS58147142A JP57030158A JP3015882A JPS58147142A JP S58147142 A JPS58147142 A JP S58147142A JP 57030158 A JP57030158 A JP 57030158A JP 3015882 A JP3015882 A JP 3015882A JP S58147142 A JPS58147142 A JP S58147142A
Authority
JP
Japan
Prior art keywords
alloy
heat resistance
conductivity
lead material
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57030158A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0253502B2 (enrdf_load_stackoverflow
Inventor
Kozo Yamato
山戸　浩三
Kiichi Akasaka
赤坂　喜一
Shigeo Shinozaki
篠崎　重雄
Taku Kuroyanagi
黒柳　卓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP57030158A priority Critical patent/JPS58147142A/ja
Publication of JPS58147142A publication Critical patent/JPS58147142A/ja
Publication of JPH0253502B2 publication Critical patent/JPH0253502B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/438—Post-treatment of the connector
    • H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0103—Zinc [Zn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0104—Zirconium [Zr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/011—Groups of the periodic table
    • H01L2924/01105—Rare earth metals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
JP57030158A 1982-02-26 1982-02-26 半導体機器のリ−ド材用銅合金 Granted JPS58147142A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57030158A JPS58147142A (ja) 1982-02-26 1982-02-26 半導体機器のリ−ド材用銅合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57030158A JPS58147142A (ja) 1982-02-26 1982-02-26 半導体機器のリ−ド材用銅合金

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP226388A Division JPS63241129A (ja) 1988-01-08 1988-01-08 半導体機器のリード材用銅合金
JP226488A Division JPS63241130A (ja) 1988-01-08 1988-01-08 半導体機器のリード材用銅合金
JP226288A Division JPS63241128A (ja) 1988-01-08 1988-01-08 半導体機器のリード材用銅合金

Publications (2)

Publication Number Publication Date
JPS58147142A true JPS58147142A (ja) 1983-09-01
JPH0253502B2 JPH0253502B2 (enrdf_load_stackoverflow) 1990-11-16

Family

ID=12295941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57030158A Granted JPS58147142A (ja) 1982-02-26 1982-02-26 半導体機器のリ−ド材用銅合金

Country Status (1)

Country Link
JP (1) JPS58147142A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6233135U (enrdf_load_stackoverflow) * 1985-08-14 1987-02-27
JPS6456842A (en) * 1987-08-27 1989-03-03 Nippon Mining Co Copper alloy foil for flexible circuit board
JPS6456841A (en) * 1987-08-27 1989-03-03 Nippon Mining Co Copper alloy foil for flexible circuit board
US5155518A (en) * 1988-08-24 1992-10-13 Nikon Corporation Focus detecting apparatus

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52123923A (en) * 1976-04-12 1977-10-18 Sumitomo Electric Ind Ltd Cu alloy for lead
JPS5347287A (en) * 1976-10-13 1978-04-27 Oki Electric Ind Co Ltd Independent gate structure photo switch
JPS5424811A (en) * 1977-07-27 1979-02-24 Hitachi Cable Ltd Copper alloy for lead conductor of semiconductor device
JPS5479121A (en) * 1977-12-07 1979-06-23 Sumitomo Electric Ind Ltd Copper alloy for trolley wire
JPS5479120A (en) * 1977-12-07 1979-06-23 Sumitomo Electric Ind Ltd Copper alloy for trolley wire
JPS5531173A (en) * 1978-08-28 1980-03-05 Nippon Steel Corp Ni-saving type nonmagnetic stainless steel for rivet and screw

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52123923A (en) * 1976-04-12 1977-10-18 Sumitomo Electric Ind Ltd Cu alloy for lead
JPS5347287A (en) * 1976-10-13 1978-04-27 Oki Electric Ind Co Ltd Independent gate structure photo switch
JPS5424811A (en) * 1977-07-27 1979-02-24 Hitachi Cable Ltd Copper alloy for lead conductor of semiconductor device
JPS5479121A (en) * 1977-12-07 1979-06-23 Sumitomo Electric Ind Ltd Copper alloy for trolley wire
JPS5479120A (en) * 1977-12-07 1979-06-23 Sumitomo Electric Ind Ltd Copper alloy for trolley wire
JPS5531173A (en) * 1978-08-28 1980-03-05 Nippon Steel Corp Ni-saving type nonmagnetic stainless steel for rivet and screw

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6233135U (enrdf_load_stackoverflow) * 1985-08-14 1987-02-27
JPS6456842A (en) * 1987-08-27 1989-03-03 Nippon Mining Co Copper alloy foil for flexible circuit board
JPS6456841A (en) * 1987-08-27 1989-03-03 Nippon Mining Co Copper alloy foil for flexible circuit board
US5155518A (en) * 1988-08-24 1992-10-13 Nikon Corporation Focus detecting apparatus

Also Published As

Publication number Publication date
JPH0253502B2 (enrdf_load_stackoverflow) 1990-11-16

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