JPS58147140A - 半導体装置のリ−ド材 - Google Patents

半導体装置のリ−ド材

Info

Publication number
JPS58147140A
JPS58147140A JP57029999A JP2999982A JPS58147140A JP S58147140 A JPS58147140 A JP S58147140A JP 57029999 A JP57029999 A JP 57029999A JP 2999982 A JP2999982 A JP 2999982A JP S58147140 A JPS58147140 A JP S58147140A
Authority
JP
Japan
Prior art keywords
alloy
lead wire
exceeding
conductivity
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57029999A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6245298B2 (esLanguage
Inventor
Rensei Futatsuka
二塚　錬成
Tadao Sakakibara
直男 榊原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP57029999A priority Critical patent/JPS58147140A/ja
Publication of JPS58147140A publication Critical patent/JPS58147140A/ja
Publication of JPS6245298B2 publication Critical patent/JPS6245298B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/01565—
    • H10W72/5525—

Landscapes

  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57029999A 1982-02-26 1982-02-26 半導体装置のリ−ド材 Granted JPS58147140A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57029999A JPS58147140A (ja) 1982-02-26 1982-02-26 半導体装置のリ−ド材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57029999A JPS58147140A (ja) 1982-02-26 1982-02-26 半導体装置のリ−ド材

Publications (2)

Publication Number Publication Date
JPS58147140A true JPS58147140A (ja) 1983-09-01
JPS6245298B2 JPS6245298B2 (esLanguage) 1987-09-25

Family

ID=12291613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57029999A Granted JPS58147140A (ja) 1982-02-26 1982-02-26 半導体装置のリ−ド材

Country Status (1)

Country Link
JP (1) JPS58147140A (esLanguage)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140339A (ja) * 1983-01-29 1984-08-11 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
JPS60174841A (ja) * 1984-02-21 1985-09-09 Furukawa Electric Co Ltd:The 電子電気機器用リン青銅
JP2007280662A (ja) * 2006-04-04 2007-10-25 Uchihashi Estec Co Ltd 筒型温度ヒューズ

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0158494U (esLanguage) * 1987-10-09 1989-04-12

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140339A (ja) * 1983-01-29 1984-08-11 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
JPS60174841A (ja) * 1984-02-21 1985-09-09 Furukawa Electric Co Ltd:The 電子電気機器用リン青銅
JP2007280662A (ja) * 2006-04-04 2007-10-25 Uchihashi Estec Co Ltd 筒型温度ヒューズ

Also Published As

Publication number Publication date
JPS6245298B2 (esLanguage) 1987-09-25

Similar Documents

Publication Publication Date Title
JPS61183426A (ja) 高力高導電性耐熱銅合金
JPS6330375B2 (esLanguage)
JPS61284946A (ja) 半導体装置用Ｃｕ合金リ−ド素材
JPH01272733A (ja) 半導体装置用Ｃｕ合金製リードフレーム材
JPS6160846A (ja) 半導体装置用銅合金リ−ド材
JPH0453936B2 (esLanguage)
JP3772319B2 (ja) リードフレーム用銅合金およびその製造方法
JPS61257443A (ja) 半導体装置用Ｃｕ合金リ−ド素材
JPS58147140A (ja) 半導体装置のリ−ド材
JPH034613B2 (esLanguage)
JPS58147139A (ja) 半導体装置のリ−ド材
JPS6250426A (ja) 電子機器用銅合金
JPS6250428A (ja) 電子機器用銅合金
JPS59153853A (ja) リ−ドフレ−ム材
JP2662209B2 (ja) メッキ密着性及びハンダ接合性に優れた電子機器用銅合金とその製造法
JPS6365748B2 (esLanguage)
JP3407527B2 (ja) 電子機器用銅合金材
JPS6393835A (ja) 半導体機器のリ−ド材用銅合金
JPS63192835A (ja) セラミツクパツケ−ジ用リ−ド材
JPS5853700B2 (ja) 半導体機器のリ−ド材用銅合金
JPS5911659A (ja) 半導体用リ−ド材
JPS6218615B2 (esLanguage)
JPH0437151B2 (esLanguage)
JPH0380856B2 (esLanguage)
JPS6396238A (ja) リ−ドフレ−ム用アルミニウム合金板