JPS58143516A - Lc複合部品における斜め半田付け方法およびその装置 - Google Patents

Lc複合部品における斜め半田付け方法およびその装置

Info

Publication number
JPS58143516A
JPS58143516A JP57026931A JP2693182A JPS58143516A JP S58143516 A JPS58143516 A JP S58143516A JP 57026931 A JP57026931 A JP 57026931A JP 2693182 A JP2693182 A JP 2693182A JP S58143516 A JPS58143516 A JP S58143516A
Authority
JP
Japan
Prior art keywords
coil
soldering
coil bobbin
chip
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57026931A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0213809B2 (enrdf_load_stackoverflow
Inventor
博 桃井
山村 正己
豊典 金高
大谷 聖史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57026931A priority Critical patent/JPS58143516A/ja
Publication of JPS58143516A publication Critical patent/JPS58143516A/ja
Publication of JPH0213809B2 publication Critical patent/JPH0213809B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP57026931A 1982-02-19 1982-02-19 Lc複合部品における斜め半田付け方法およびその装置 Granted JPS58143516A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57026931A JPS58143516A (ja) 1982-02-19 1982-02-19 Lc複合部品における斜め半田付け方法およびその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57026931A JPS58143516A (ja) 1982-02-19 1982-02-19 Lc複合部品における斜め半田付け方法およびその装置

Publications (2)

Publication Number Publication Date
JPS58143516A true JPS58143516A (ja) 1983-08-26
JPH0213809B2 JPH0213809B2 (enrdf_load_stackoverflow) 1990-04-05

Family

ID=12206900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57026931A Granted JPS58143516A (ja) 1982-02-19 1982-02-19 Lc複合部品における斜め半田付け方法およびその装置

Country Status (1)

Country Link
JP (1) JPS58143516A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6163357A (ja) * 1984-09-04 1986-04-01 Tamura Seisakusho Co Ltd はんだ付け装置
US4841318A (en) * 1984-11-14 1989-06-20 Minolta Camera Kabushiki Kaisha Camera system with mode selecting device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7431614B2 (ja) 2020-02-21 2024-02-15 三菱重工コンプレッサ株式会社 回転機械

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6163357A (ja) * 1984-09-04 1986-04-01 Tamura Seisakusho Co Ltd はんだ付け装置
US4841318A (en) * 1984-11-14 1989-06-20 Minolta Camera Kabushiki Kaisha Camera system with mode selecting device
US4849779A (en) * 1984-11-14 1989-07-18 Minolta Camera Kabushiki Kaisha Moving driving device of camera

Also Published As

Publication number Publication date
JPH0213809B2 (enrdf_load_stackoverflow) 1990-04-05

Similar Documents

Publication Publication Date Title
TW394963B (en) Ceramic capacitor
JP5210323B2 (ja) 無鉛ソルダ合金
JP4240356B2 (ja) Pbフリーはんだ組成物およびはんだ付け物品
JP4130508B2 (ja) 半田接合方法及び電子装置の製造方法
JPS58143516A (ja) Lc複合部品における斜め半田付け方法およびその装置
JP4070232B2 (ja) 配線基板及びその製造方法
TW201205613A (en) Electronic component
US20090129971A1 (en) Lead-free soft solder
CN214203673U (zh) 一种弯折引线式超薄二极管
CN113643897B (zh) 一种制作陶瓷电容的方法及陶瓷电容
TWI334366B (enrdf_load_stackoverflow)
TW410367B (en) Improved solder balls and use thereof
TW315473B (enrdf_load_stackoverflow)
CN208507725U (zh) 一种无引线的数码管芯片
CN105834611A (zh) 一种适用于电子封装的高电导高可靠性Ce-Sn-Ag-Cu焊料
CN101342643A (zh) 含稀土钕的抗氧化无铅焊料
CN114226901B (zh) 一种多双孪晶组和细小晶粒构成的多晶结构焊点生成方法
JPS58110024A (ja) セラミツクコンデンサ端子電極組成
JPH0684916A (ja) 多層バンプ
CN216683766U (zh) 一种新型回收墨盒喷墨芯片结构
CN215644132U (zh) 一种陶瓷电容
CN208861973U (zh) 金手指缝点焊接结构
CN209151129U (zh) 一种可抵抗高回流焊温度的表晶谐振器
CN207782957U (zh) 摄像模组及底座与基板的组件
JP2516606Y2 (ja) 表面実装型電子部品