^036' 五、發明說明（ 經濟部智慧財產局員工消費合作社印製 技術範圍 本發明係一般關係於球格排列模紐，JL體言之，係—一 種此類独之烊接球與接合此種模組於其它電子元件之改 良.。 發明背景 W0 97/01866提出-種球格排列模组。該已知之模组利 用。有具相田问熔岫溫度球核與具較低熔融溫度焊劑覆層 之焊接球。球核可以是例如銅質之金屬，或是熔融溫度較 焊劑覆層爲高之焊劑。 以銅球核作爲機械隔件之坪接球之—缺點，在油不具有 在焊接接點承受到溫度循環作用所需之應力消除能力。 具高鉛成份焊劑之焊接球適合作爲隔件，因其具有該項 所需之應力消除能力。 然而此種焊接球缺點之—，在於會產生在此類烊接球奉 面之鉛氧化物，使其焊接性不良。此氧化物包括了原生氧 化物，以及當焊接球以傳統焊接漿形式應用於具低熔融溫 度焊劑，焊接到球格排列模組連接墊時，焊接球受熱產生 之氧化物。 焊接球焊接性不良，可導致焊接球無法在連接墊對正位 置。同時，若焊接球焊接性差，焊接球會有某種程度的浮 在低熔融溫度焊劑上，使得焊接球頂端，亦即位於連接塾 遠端者，其高低會不一致。這一點在所附圖〗左邊續圖示 出，其中¥球1示如未對正的〃浮"在一球格排列模組（圖上 未示）基材3之焊劑2上，而焊接球4未對正的停駐在基材3 M A . 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） τ. -n 1% n 1· n T— I 1 I B n n (請先閲讀背面之注意事項厂k寫本買) 訂· •線. Γ 五、發明說明（2 ) A7 B7 經濟部智慧財產局員工消費合作社印製 ’或疋在基材3之連接塾上（圖上未示）β由圖1明顯看出， 焊接球2與4在不同的高度位置。 焊接球焊接性差，亦可能使模組上焊接球間阻隔距離過 短’而在最差情況下造成相鄰焊接球短路。此點在圖1右 方繪圖示意，其相鄰之焊接球5與6未能對正停駐於基材3 ’甚至實際相互接觸，造成短路。 發明摘要 本發明之目的’即在消除已知焊接球之上述缺點β 作法係依據本發明，改良具高熔融溫度焊劑焊接球焊接 性，首先自焊接球除移原生氧化物，再於新氧化物生成前 ，積附一層保護層於焊接球，可使焊接球焊接連接墊。 依據本發明改良後之焊接球焊接性，將不再產生焊接球 在連接墊上的對正問題。因此這種焊接接合獲得改良。 附圖簡述 本發明以下將以前述所附圖作參考作更詳細説明，附圖 1説明以往焊接球焊接到基材技藝之具體實例，附圖2説明 依本發明之焊接球，附圖3説明依本發明焊接到一基材之 焊接球。 發明内容敍沭 圖2爲根據本發明之焊接球7。 、該焊接球7包含具高熔融溫度烊料之球核8，較佳爲鉛9〇 锡10或8 8錫1 〇銀2。 如前述對圖1敘述所指出，若以傳統焊接漿方式，焊接 此種焊接球於連接墊（圖上未示），則由於此種焊接球表面 ___ -5- ^紙張尺度翻中@07辟（CNS)A4縣（21Qχ297^ 036 'V. Description of Invention (Scope of Printing Technology of Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. The present invention is generally related to the arrangement of ball grids. JL said that it is a kind of such a unique catch and joint. Modification of this module to other electronic components ... Background of the invention WO 97/01866 proposes a ball grid array module. This known module is used. It has a sphere core with a melting temperature and a flux coating with a lower melting temperature. Layer of solder balls. The core can be, for example, copper metal, or a flux with a higher melting temperature than the flux coating. The use of copper cores as mechanical spacers for the ball-adaptation—the disadvantage is that the oil does not have welding The contact can withstand the stress-relief ability required by temperature cycling. A solder ball with high lead flux is suitable as a spacer because it has the required stress-removal ability. However, the disadvantage of this solder ball is that it will The lead oxide generated on the surface of this type of ball contact makes it poor in solderability. This oxide includes the primary oxide, and when the solder ball is used in the form of traditional solder paste for low-melting temperature flux, welding When the ball grid arranges the module connection pads, the oxide generated by the solder ball is heated. Poor solderability of the solder ball can cause the solder ball to fail to be aligned with the connection pad. At the same time, if the solder ball has poor solderability, the solder ball will have a certain degree It floats on the low melting temperature flux, so that the top of the solder ball, that is, the one located at the far end of the connection ridge, will be inconsistent in height. This is shown in the figure on the left of the attached figure, where ¥ Ball 1 is not aligned. "Floating" on a ball grid array module (not shown in the figure) on the solder 2 of the substrate 3, and the solder ball 4 is not aligned on the substrate 3 MA. This paper size applies Chinese national standards ( CNS) A4 specification (210 X 297 mm) τ. -N 1% n 1 · n T— I 1 IB nn (please read the notes on the back of the factory to write in the k-book) Order · • Wire. Γ 5. Description of the invention (2) A7 B7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs' or 疋 on the connection 基材 of the substrate 3 (not shown in the figure) β is clearly seen in Fig. 1, the solder balls 2 and 4 are at different height positions The poor solderability of the solder balls may also make the distance between the solder balls on the module too short. In the worst case, the adjacent solder balls are short-circuited. This point is illustrated on the right side of Figure 1. The adjacent solder balls 5 and 6 fail to stop right on the substrate 3 'or even actually contact each other, resulting in a short circuit. Abstract The purpose of the present invention is to eliminate the above-mentioned shortcomings of known solder balls. The β method is to improve the solderability of solder balls with high melting temperature flux according to the present invention. First, the primary oxide is removed from the solder ball, and then the new oxide is formed. Previously, a protective layer was deposited on the welding ball, so that the welding ball can be welded to the connection pad. According to the improved weldability of the welding ball according to the present invention, the problem of the alignment of the welding ball on the connection pad will no longer occur. BRIEF DESCRIPTION OF THE DRAWINGS The present invention will be described in more detail below with reference to the aforementioned drawings. FIG. 1 illustrates a specific example of a conventional solder ball welding technique to a substrate, and FIG. 2 illustrates a solder ball according to the present invention. Figure 3 illustrates a solder ball soldered to a substrate in accordance with the present invention. SUMMARY OF THE INVENTION Fig. 2 shows a solder ball 7 according to the present invention. The solder ball 7 includes a core 8 with a high melting temperature material, preferably lead 90 tin 10 or 88 tin 10 silver 2. As pointed out in the description of FIG. 1 above, if this type of solder ball is welded to the connection pad (not shown in the figure) by the traditional solder paste method, because the surface of this solder ball is ___ -5- ^ paper size turn over @ 07 Pioneer (CNS) A4 County (21Qχ297
Vi I ίν 1 I ϋ I. te I 1 * I I (請先軋讀背面之注Jt.¥項广w寫本頁) !訂_ -線. A7 410367 五、發明說明（3 ) ^!!! — ·裝 i — (請先膊讀背面之注音？事項厂>、寫本頁) 之原生氧化物故，焊接性會差，導致焊接球無法在連接墊 對正，或是浮在連接墊上焊劑上，如圖1所示。 根據本發明以改良該焊接球焊接性，首先利用如HC1的 酸’或一種還原劑，自球核8移除原生氧化物。 其後再於球核8生出新氧化物前，避免氧與球核8反應， 積附一層保護層9於不含原生氧化物之球核8上。 根據本發明，選用該層9之金屬，可使烊接球7以傳統焊 接漿焊接於基材。 保護層9之金屬係自包含銀，金，銦，鈀，鉑，與錫之組 中選用。 線- 參考圖3 ’當以依本發明之焊接球7，如圖2所示者，以 傳統焊接漿方式，焊接於球格排列模组基材丨〇之連接墊（ 圖上未示）時，由於焊接球7之獲改良焊接性，其可如圖3 所示對正於哼接漿。在根據本發明焊接球7焊接時，焊接 漿的熱會熔融該保護層，若其爲錫或銦，並與不含氧化物 I球核8焊接。若使用銀或金，則保護層9會溶入焊接漿。 經濟部智慧財產局員工消費合作社印製 若使用鈀或鉑，該保護層9會停留在焊接球7表面、焊接漿 與保護層9焊接。 當具有如本發明焊接球7之球格排列模組，與另—電子 π件如印刷電路板（圖上未示）焊接時，焊接球7對印刷電 路板上連接墊的焊接性亦獲得改良，這點歸功於焊接球7 表面上所留存，位於球格排列模組遠端之保護金屬層9。 综上所述，可明顯看出藉著根據本發明改良焊接球焊接 性，既往技藝之焊接球問題可以獲得解決。 本紙張尺茂顧悄國家標準（CNS)A4規格（210 X 297公爱）_Vi I ίν 1 I ϋ I. te I 1 * II (please read the note on the back Jt. ¥ Xianguangw to write this page)! Order _ -line. A7 410367 V. Description of the invention (3) ^ !!! — · Install i — (Please read the phonetic note on the back? Matters Factory>, write this page) Therefore, the weldability will be poor, resulting in the solder ball cannot be aligned on the connection pad, or the solder floats on the connection pad. On, as shown in Figure 1. To improve the solderability of the solder ball according to the present invention, the primary oxide is first removed from the core 8 using an acid such as HC1 or a reducing agent. After that, before the core 8 generates a new oxide, the oxygen is prevented from reacting with the core 8 and a protective layer 9 is deposited on the core 8 without the primary oxide. According to the present invention, the metal of the layer 9 is selected, so that the ball 7 can be welded to the substrate by a conventional welding paste. The metal of the protective layer 9 is selected from the group consisting of silver, gold, indium, palladium, platinum, and tin. Line-Refer to Figure 3 'When the solder ball 7 according to the present invention, as shown in Figure 2, is welded to the connection pad (not shown in the figure) of the ball grid array module substrate using the traditional solder paste method. Due to the improved weldability of the solder ball 7, it can be aligned with the humming slurry as shown in FIG. When the solder ball 7 is soldered according to the present invention, the heat of the solder paste will melt the protective layer if it is tin or indium, and solder with the oxide-free ball core 8. If silver or gold is used, the protective layer 9 is dissolved in the solder paste. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. If palladium or platinum is used, the protective layer 9 will stay on the surface of the solder ball 7 and the welding paste will be welded to the protective layer 9. When the ball grid array module with the solder ball 7 according to the present invention is soldered to another electronic component such as a printed circuit board (not shown in the figure), the solderability of the solder ball 7 to the connection pad on the printed circuit board is also improved. This is due to the protective metal layer 9 which is retained on the surface of the solder ball 7 and located at the far end of the ball grid array module. In summary, it can be clearly seen that by improving the weldability of the solder ball according to the present invention, the problem of the solder ball of the prior art can be solved. This paper ruler follows the national standard (CNS) A4 specification (210 X 297 public love) _