SE9901427D0 - Improved solder balls and use thereof - Google Patents
Improved solder balls and use thereofInfo
- Publication number
- SE9901427D0 SE9901427D0 SE9901427A SE9901427A SE9901427D0 SE 9901427 D0 SE9901427 D0 SE 9901427D0 SE 9901427 A SE9901427 A SE 9901427A SE 9901427 A SE9901427 A SE 9901427A SE 9901427 D0 SE9901427 D0 SE 9901427D0
- Authority
- SE
- Sweden
- Prior art keywords
- solder ball
- solder balls
- solder
- ball
- improved solder
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0435—Metal coated solder, e.g. for passivation of solder balls
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Solderability of a solder ball of solder having a high melting temperature to be used as an electrical and mechanical connection means in a ball grid array module, is improved by first removing native oxide from the solder ball (8), and, then, to prevent formation of new oxide on the solder ball, depositing a protective layer (9) of a metal enabling soldering of the solder ball by a conventional soldering paste.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9901427A SE515028C2 (en) | 1999-04-21 | 1999-04-21 | Improved soldering balls and the use of such |
TW088108738A TW410367B (en) | 1999-04-21 | 1999-05-27 | Improved solder balls and use thereof |
PCT/SE2000/000671 WO2000064625A1 (en) | 1999-04-21 | 2000-04-07 | Improved solder balls and use thereof |
AU46315/00A AU4631500A (en) | 1999-04-21 | 2000-04-07 | Improved solder balls and use thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9901427A SE515028C2 (en) | 1999-04-21 | 1999-04-21 | Improved soldering balls and the use of such |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9901427D0 true SE9901427D0 (en) | 1999-04-21 |
SE9901427L SE9901427L (en) | 2000-10-22 |
SE515028C2 SE515028C2 (en) | 2001-05-28 |
Family
ID=20415300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9901427A SE515028C2 (en) | 1999-04-21 | 1999-04-21 | Improved soldering balls and the use of such |
Country Status (4)
Country | Link |
---|---|
AU (1) | AU4631500A (en) |
SE (1) | SE515028C2 (en) |
TW (1) | TW410367B (en) |
WO (1) | WO2000064625A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107073656B (en) * | 2014-11-05 | 2018-07-03 | 千住金属工业株式会社 | Solderable material, soldering paste, the management method for shaping solder, soldered fitting and solderable material |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5340411A (en) * | 1993-10-12 | 1994-08-23 | Hughes Aircraft Company | Surface treatment method for fatigue-resistant solder |
EP0747954A3 (en) * | 1995-06-07 | 1997-05-07 | Ibm | Reflowed solder ball with low melting point metal cap |
WO1997001866A1 (en) * | 1995-06-29 | 1997-01-16 | Minnesota Mining And Manufacturing Company | Ball grid array package utilizing solder coated spheres |
US5899737A (en) * | 1996-09-20 | 1999-05-04 | Lsi Logic Corporation | Fluxless solder ball attachment process |
-
1999
- 1999-04-21 SE SE9901427A patent/SE515028C2/en not_active IP Right Cessation
- 1999-05-27 TW TW088108738A patent/TW410367B/en not_active IP Right Cessation
-
2000
- 2000-04-07 WO PCT/SE2000/000671 patent/WO2000064625A1/en active Search and Examination
- 2000-04-07 AU AU46315/00A patent/AU4631500A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TW410367B (en) | 2000-11-01 |
SE515028C2 (en) | 2001-05-28 |
AU4631500A (en) | 2000-11-10 |
SE9901427L (en) | 2000-10-22 |
WO2000064625A1 (en) | 2000-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |