JPS58138115A - チップ状圧電振動部品の製造方法 - Google Patents
チップ状圧電振動部品の製造方法Info
- Publication number
- JPS58138115A JPS58138115A JP2146182A JP2146182A JPS58138115A JP S58138115 A JPS58138115 A JP S58138115A JP 2146182 A JP2146182 A JP 2146182A JP 2146182 A JP2146182 A JP 2146182A JP S58138115 A JPS58138115 A JP S58138115A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric
- electrode
- insulator
- electrodes
- vibration unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012212 insulator Substances 0.000 claims abstract description 37
- 238000000605 extraction Methods 0.000 claims description 20
- 238000010897 surface acoustic wave method Methods 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract description 3
- 230000010355 oscillation Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 description 21
- 239000000758 substrate Substances 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 230000005284 excitation Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000017963 Cornus kousa Nutrition 0.000 description 1
- 244000274051 Cornus kousa Species 0.000 description 1
- 241000277269 Oncorhynchus masou Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/566—Electric coupling means therefor
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2146182A JPS58138115A (ja) | 1982-02-12 | 1982-02-12 | チップ状圧電振動部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2146182A JPS58138115A (ja) | 1982-02-12 | 1982-02-12 | チップ状圧電振動部品の製造方法 |
Related Child Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7952782A Division JPS58139513A (ja) | 1982-05-11 | 1982-05-11 | チップ状圧電振動部品の製造方法 |
| JP8446282A Division JPS58139514A (ja) | 1982-05-18 | 1982-05-18 | チップ状圧電振動部品の製造方法 |
| JP8630182A Division JPS58139511A (ja) | 1982-05-20 | 1982-05-20 | チツプ状圧電振動部品の製造方法 |
| JP8692282A Division JPS58139515A (ja) | 1982-05-21 | 1982-05-21 | チップ状圧電振動部品の製造方法 |
| JP8868182A Division JPS58139516A (ja) | 1982-05-24 | 1982-05-24 | チツプ状圧電振動部品 |
| JP8868282A Division JPS58139517A (ja) | 1982-05-24 | 1982-05-24 | チツプ状圧電振動部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58138115A true JPS58138115A (ja) | 1983-08-16 |
| JPH0155604B2 JPH0155604B2 (US07943777-20110517-C00090.png) | 1989-11-27 |
Family
ID=12055613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2146182A Granted JPS58138115A (ja) | 1982-02-12 | 1982-02-12 | チップ状圧電振動部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58138115A (US07943777-20110517-C00090.png) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58205319A (ja) * | 1982-05-25 | 1983-11-30 | Citizen Watch Co Ltd | 弾性表面波装置 |
| FR2579829A1 (fr) * | 1985-03-29 | 1986-10-03 | Thomson Csf | Procede de fabrication de dispositifs a ondes de surface |
| US4734608A (en) * | 1985-11-07 | 1988-03-29 | Alps Electric Co., Ltd. | Elastic surface wave element |
| US4736128A (en) * | 1986-01-28 | 1988-04-05 | Alps Electric Co., Ltd. | Surface acoustic wave device |
| JPH01142215U (US07943777-20110517-C00090.png) * | 1988-03-23 | 1989-09-29 | ||
| US4920296A (en) * | 1984-10-17 | 1990-04-24 | Murata Manufacturing Co., Ltd. | Electronic component having a plate-shaped element |
| US5019742A (en) * | 1986-03-12 | 1991-05-28 | Northern Telecom Limited | Saw device with apodized IDT |
| EP0682408A1 (en) * | 1994-05-09 | 1995-11-15 | Murata Manufacturing Co., Ltd. | SAW device |
| EP0907243A2 (en) * | 1997-10-03 | 1999-04-07 | Murata Manufacturing Co., Ltd. | Electronic component and ladder filter |
| EP0939485A1 (en) * | 1998-02-27 | 1999-09-01 | TDK Corporation | Chip device and method for producing the same |
| JP2007180995A (ja) * | 2005-12-28 | 2007-07-12 | Kyocera Kinseki Corp | 圧電振動子 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5472696A (en) * | 1977-11-21 | 1979-06-11 | Citizen Watch Co Ltd | Package for super miniature size piezoelectric oscillator |
| JPS5661820A (en) * | 1979-10-25 | 1981-05-27 | Matsushima Kogyo Co Ltd | Quartz oscillator |
| JPS5717124A (en) * | 1980-07-05 | 1982-01-28 | Tdk Electronics Co Ltd | Capacitor and method of producing same |
-
1982
- 1982-02-12 JP JP2146182A patent/JPS58138115A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5472696A (en) * | 1977-11-21 | 1979-06-11 | Citizen Watch Co Ltd | Package for super miniature size piezoelectric oscillator |
| JPS5661820A (en) * | 1979-10-25 | 1981-05-27 | Matsushima Kogyo Co Ltd | Quartz oscillator |
| JPS5717124A (en) * | 1980-07-05 | 1982-01-28 | Tdk Electronics Co Ltd | Capacitor and method of producing same |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58205319A (ja) * | 1982-05-25 | 1983-11-30 | Citizen Watch Co Ltd | 弾性表面波装置 |
| JPH0351132B2 (US07943777-20110517-C00090.png) * | 1982-05-25 | 1991-08-05 | Citizen Watch Co Ltd | |
| US4920296A (en) * | 1984-10-17 | 1990-04-24 | Murata Manufacturing Co., Ltd. | Electronic component having a plate-shaped element |
| FR2579829A1 (fr) * | 1985-03-29 | 1986-10-03 | Thomson Csf | Procede de fabrication de dispositifs a ondes de surface |
| US4734608A (en) * | 1985-11-07 | 1988-03-29 | Alps Electric Co., Ltd. | Elastic surface wave element |
| US4736128A (en) * | 1986-01-28 | 1988-04-05 | Alps Electric Co., Ltd. | Surface acoustic wave device |
| US5019742A (en) * | 1986-03-12 | 1991-05-28 | Northern Telecom Limited | Saw device with apodized IDT |
| JPH01142215U (US07943777-20110517-C00090.png) * | 1988-03-23 | 1989-09-29 | ||
| EP0682408A1 (en) * | 1994-05-09 | 1995-11-15 | Murata Manufacturing Co., Ltd. | SAW device |
| EP0907243A2 (en) * | 1997-10-03 | 1999-04-07 | Murata Manufacturing Co., Ltd. | Electronic component and ladder filter |
| EP0907243A3 (en) * | 1997-10-03 | 2000-08-23 | Murata Manufacturing Co., Ltd. | Electronic component and ladder filter |
| EP0939485A1 (en) * | 1998-02-27 | 1999-09-01 | TDK Corporation | Chip device and method for producing the same |
| JP2007180995A (ja) * | 2005-12-28 | 2007-07-12 | Kyocera Kinseki Corp | 圧電振動子 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0155604B2 (US07943777-20110517-C00090.png) | 1989-11-27 |
