JPS58135963U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58135963U
JPS58135963U JP1982032202U JP3220282U JPS58135963U JP S58135963 U JPS58135963 U JP S58135963U JP 1982032202 U JP1982032202 U JP 1982032202U JP 3220282 U JP3220282 U JP 3220282U JP S58135963 U JPS58135963 U JP S58135963U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
header
electrode pad
semiconductor device
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982032202U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6344994Y2 (https=
Inventor
久雄 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1982032202U priority Critical patent/JPS58135963U/ja
Publication of JPS58135963U publication Critical patent/JPS58135963U/ja
Application granted granted Critical
Publication of JPS6344994Y2 publication Critical patent/JPS6344994Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1982032202U 1982-03-08 1982-03-08 半導体装置 Granted JPS58135963U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982032202U JPS58135963U (ja) 1982-03-08 1982-03-08 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982032202U JPS58135963U (ja) 1982-03-08 1982-03-08 半導体装置

Publications (2)

Publication Number Publication Date
JPS58135963U true JPS58135963U (ja) 1983-09-13
JPS6344994Y2 JPS6344994Y2 (https=) 1988-11-22

Family

ID=30043831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982032202U Granted JPS58135963U (ja) 1982-03-08 1982-03-08 半導体装置

Country Status (1)

Country Link
JP (1) JPS58135963U (https=)

Also Published As

Publication number Publication date
JPS6344994Y2 (https=) 1988-11-22

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