JPS58131741A - ペレットボンディング用フラックス付け装置 - Google Patents

ペレットボンディング用フラックス付け装置

Info

Publication number
JPS58131741A
JPS58131741A JP57014232A JP1423282A JPS58131741A JP S58131741 A JPS58131741 A JP S58131741A JP 57014232 A JP57014232 A JP 57014232A JP 1423282 A JP1423282 A JP 1423282A JP S58131741 A JPS58131741 A JP S58131741A
Authority
JP
Japan
Prior art keywords
flux
pellet
bonding
lead frame
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57014232A
Other languages
English (en)
Japanese (ja)
Other versions
JPH035661B2 (cg-RX-API-DMAC7.html
Inventor
Koichi Orita
折田　浩一
Kazuhiro Hayakawa
和宏 早川
Seiichi Chiba
誠一 千葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP57014232A priority Critical patent/JPS58131741A/ja
Publication of JPS58131741A publication Critical patent/JPS58131741A/ja
Publication of JPH035661B2 publication Critical patent/JPH035661B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
JP57014232A 1982-01-29 1982-01-29 ペレットボンディング用フラックス付け装置 Granted JPS58131741A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57014232A JPS58131741A (ja) 1982-01-29 1982-01-29 ペレットボンディング用フラックス付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57014232A JPS58131741A (ja) 1982-01-29 1982-01-29 ペレットボンディング用フラックス付け装置

Publications (2)

Publication Number Publication Date
JPS58131741A true JPS58131741A (ja) 1983-08-05
JPH035661B2 JPH035661B2 (cg-RX-API-DMAC7.html) 1991-01-28

Family

ID=11855321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57014232A Granted JPS58131741A (ja) 1982-01-29 1982-01-29 ペレットボンディング用フラックス付け装置

Country Status (1)

Country Link
JP (1) JPS58131741A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004057651A1 (de) * 2002-12-19 2004-07-08 Siemens Aktiengesellschaft Vorrichtung und verfahren zum transport einer komponente

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103576A (en) * 1977-02-23 1978-09-08 Pioneer Electronic Corp Device for automatically soldering printed circuit board
JPS56161340U (cg-RX-API-DMAC7.html) * 1980-04-28 1981-12-01

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103576A (en) * 1977-02-23 1978-09-08 Pioneer Electronic Corp Device for automatically soldering printed circuit board
JPS56161340U (cg-RX-API-DMAC7.html) * 1980-04-28 1981-12-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004057651A1 (de) * 2002-12-19 2004-07-08 Siemens Aktiengesellschaft Vorrichtung und verfahren zum transport einer komponente

Also Published As

Publication number Publication date
JPH035661B2 (cg-RX-API-DMAC7.html) 1991-01-28

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