JPS53103576A - Device for automatically soldering printed circuit board - Google Patents

Device for automatically soldering printed circuit board

Info

Publication number
JPS53103576A
JPS53103576A JP1904277A JP1904277A JPS53103576A JP S53103576 A JPS53103576 A JP S53103576A JP 1904277 A JP1904277 A JP 1904277A JP 1904277 A JP1904277 A JP 1904277A JP S53103576 A JPS53103576 A JP S53103576A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
soldering printed
automatically soldering
automatically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1904277A
Other languages
Japanese (ja)
Other versions
JPS6123061B2 (en
Inventor
Toyonori Igata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Electronic Corp filed Critical Pioneer Electronic Corp
Priority to JP1904277A priority Critical patent/JPS53103576A/en
Publication of JPS53103576A publication Critical patent/JPS53103576A/en
Publication of JPS6123061B2 publication Critical patent/JPS6123061B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1904277A 1977-02-23 1977-02-23 Device for automatically soldering printed circuit board Granted JPS53103576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1904277A JPS53103576A (en) 1977-02-23 1977-02-23 Device for automatically soldering printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1904277A JPS53103576A (en) 1977-02-23 1977-02-23 Device for automatically soldering printed circuit board

Publications (2)

Publication Number Publication Date
JPS53103576A true JPS53103576A (en) 1978-09-08
JPS6123061B2 JPS6123061B2 (en) 1986-06-04

Family

ID=11988357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1904277A Granted JPS53103576A (en) 1977-02-23 1977-02-23 Device for automatically soldering printed circuit board

Country Status (1)

Country Link
JP (1) JPS53103576A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58131741A (en) * 1982-01-29 1983-08-05 Shinkawa Ltd Pellet bonding method and flux application device using said method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432042U (en) * 1977-08-08 1979-03-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432042U (en) * 1977-08-08 1979-03-02

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58131741A (en) * 1982-01-29 1983-08-05 Shinkawa Ltd Pellet bonding method and flux application device using said method
JPH035661B2 (en) * 1982-01-29 1991-01-28 Shinkawa Kk

Also Published As

Publication number Publication date
JPS6123061B2 (en) 1986-06-04

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