JPS5812468Y2 - プリント配線板の放熱装置 - Google Patents
プリント配線板の放熱装置Info
- Publication number
- JPS5812468Y2 JPS5812468Y2 JP9180480U JP9180480U JPS5812468Y2 JP S5812468 Y2 JPS5812468 Y2 JP S5812468Y2 JP 9180480 U JP9180480 U JP 9180480U JP 9180480 U JP9180480 U JP 9180480U JP S5812468 Y2 JPS5812468 Y2 JP S5812468Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- heat dissipation
- dissipation device
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9180480U JPS5812468Y2 (ja) | 1980-06-30 | 1980-06-30 | プリント配線板の放熱装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9180480U JPS5812468Y2 (ja) | 1980-06-30 | 1980-06-30 | プリント配線板の放熱装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5714476U JPS5714476U (enrdf_load_stackoverflow) | 1982-01-25 |
| JPS5812468Y2 true JPS5812468Y2 (ja) | 1983-03-09 |
Family
ID=29453774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9180480U Expired JPS5812468Y2 (ja) | 1980-06-30 | 1980-06-30 | プリント配線板の放熱装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5812468Y2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62214053A (ja) * | 1986-03-12 | 1987-09-19 | Nippon Plast Co Ltd | ステアリング装置 |
| JP2746820B2 (ja) * | 1993-06-15 | 1998-05-06 | 松下精工株式会社 | 電子部品のプリント配線板 |
-
1980
- 1980-06-30 JP JP9180480U patent/JPS5812468Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5714476U (enrdf_load_stackoverflow) | 1982-01-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2005012088A (ja) | 多層回路基板および電子機器 | |
| JPS5812468Y2 (ja) | プリント配線板の放熱装置 | |
| JP2005183559A (ja) | プリント配線板およびその製造方法 | |
| JPH05191002A (ja) | 多層回路板 | |
| TW480691B (en) | Printed-circuit board and method of mounting electric components thereon | |
| JP2021111718A (ja) | 電子機器 | |
| JP2933729B2 (ja) | プリント配線基板装置 | |
| JP2002151634A (ja) | 基板放熱装置 | |
| JP2002111260A (ja) | 電子機器の放熱構造 | |
| JP2564645Y2 (ja) | 発熱部品を有する混成集積回路装置 | |
| JP2000315747A (ja) | 半導体パッケージ | |
| JPH11112152A (ja) | フリップチップ実装の多層プリント基板 | |
| JP2002094196A (ja) | プリント配線板の電子部品放熱構造 | |
| JPS622787Y2 (enrdf_load_stackoverflow) | ||
| JPH0555421A (ja) | 混成集積回路装置 | |
| JPH10215048A (ja) | プリント配線板及びプリント配線板の実装構造 | |
| JPH0555719A (ja) | 回路基板装置 | |
| JPH11121933A (ja) | 多層プリント配線板および電子部品を実装したプリント配線板 | |
| JP3890247B2 (ja) | 多層フレキシブルプリント基板及び多層フラットケーブル並びにこれらを用いた電気接続箱 | |
| JP3038144B2 (ja) | 回路基板 | |
| JPH056947A (ja) | 半導体素子を搭載する基板装置 | |
| JPS587657Y2 (ja) | 多層印刷配線板 | |
| JPH0231794Y2 (enrdf_load_stackoverflow) | ||
| JPH0573978U (ja) | 放熱装置 | |
| JPS6142880B2 (enrdf_load_stackoverflow) |