JPS58122759A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58122759A
JPS58122759A JP442282A JP442282A JPS58122759A JP S58122759 A JPS58122759 A JP S58122759A JP 442282 A JP442282 A JP 442282A JP 442282 A JP442282 A JP 442282A JP S58122759 A JPS58122759 A JP S58122759A
Authority
JP
Japan
Prior art keywords
package
cap
radio waves
frequency radio
paint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP442282A
Other languages
English (en)
Japanese (ja)
Other versions
JPH044753B2 (enrdf_load_stackoverflow
Inventor
Akihiro Kubota
昭弘 窪田
Junichi Kasai
純一 河西
Tsuyoshi Aoki
強 青木
Michio Ono
小野 道夫
Masao Takehiro
武広 正雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP442282A priority Critical patent/JPS58122759A/ja
Publication of JPS58122759A publication Critical patent/JPS58122759A/ja
Publication of JPH044753B2 publication Critical patent/JPH044753B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/66High-frequency adaptations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/552Protection against radiation, e.g. light or electromagnetic waves
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP442282A 1982-01-14 1982-01-14 半導体装置 Granted JPS58122759A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP442282A JPS58122759A (ja) 1982-01-14 1982-01-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP442282A JPS58122759A (ja) 1982-01-14 1982-01-14 半導体装置

Publications (2)

Publication Number Publication Date
JPS58122759A true JPS58122759A (ja) 1983-07-21
JPH044753B2 JPH044753B2 (enrdf_load_stackoverflow) 1992-01-29

Family

ID=11583827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP442282A Granted JPS58122759A (ja) 1982-01-14 1982-01-14 半導体装置

Country Status (1)

Country Link
JP (1) JPS58122759A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121653U (ja) * 1984-01-27 1985-08-16 株式会社東芝 半導体装置の外囲器
JPS60180852A (ja) * 1984-02-28 1985-09-14 Kyocera Corp 熱印刷装置
JPS60163751U (ja) * 1984-04-04 1985-10-30 スタンレー電気株式会社 半導体装置
JPS61114564A (ja) * 1984-11-09 1986-06-02 Nec Corp 静電破壊防止機構付きicパツケ−ジ
JPS61195067U (enrdf_load_stackoverflow) * 1985-05-24 1986-12-04
JPS6230356U (enrdf_load_stackoverflow) * 1985-08-07 1987-02-24
FR2774810A1 (fr) * 1998-02-10 1999-08-13 St Microelectronics Sa Boitier semi-conducteur blinde et procede pour sa fabrication
US9070793B2 (en) 2010-08-02 2015-06-30 Advanced Semiconductor Engineering, Inc. Semiconductor device packages having electromagnetic interference shielding and related methods

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4863657U (enrdf_load_stackoverflow) * 1971-11-22 1973-08-13
JPS51138165A (en) * 1975-05-23 1976-11-29 Mitsubishi Electric Corp Package stracture for thermal resistance and shield

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4863657U (enrdf_load_stackoverflow) * 1971-11-22 1973-08-13
JPS51138165A (en) * 1975-05-23 1976-11-29 Mitsubishi Electric Corp Package stracture for thermal resistance and shield

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121653U (ja) * 1984-01-27 1985-08-16 株式会社東芝 半導体装置の外囲器
JPS60180852A (ja) * 1984-02-28 1985-09-14 Kyocera Corp 熱印刷装置
JPS60163751U (ja) * 1984-04-04 1985-10-30 スタンレー電気株式会社 半導体装置
JPS61114564A (ja) * 1984-11-09 1986-06-02 Nec Corp 静電破壊防止機構付きicパツケ−ジ
JPS61195067U (enrdf_load_stackoverflow) * 1985-05-24 1986-12-04
JPS6230356U (enrdf_load_stackoverflow) * 1985-08-07 1987-02-24
FR2774810A1 (fr) * 1998-02-10 1999-08-13 St Microelectronics Sa Boitier semi-conducteur blinde et procede pour sa fabrication
US6312975B1 (en) 1998-02-10 2001-11-06 Stmicroelectronics S.A. Semiconductor package and method of manufacturing the same
US9070793B2 (en) 2010-08-02 2015-06-30 Advanced Semiconductor Engineering, Inc. Semiconductor device packages having electromagnetic interference shielding and related methods

Also Published As

Publication number Publication date
JPH044753B2 (enrdf_load_stackoverflow) 1992-01-29

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