JPS58122759A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS58122759A JPS58122759A JP442282A JP442282A JPS58122759A JP S58122759 A JPS58122759 A JP S58122759A JP 442282 A JP442282 A JP 442282A JP 442282 A JP442282 A JP 442282A JP S58122759 A JPS58122759 A JP S58122759A
- Authority
- JP
- Japan
- Prior art keywords
- package
- cap
- radio waves
- frequency radio
- paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP442282A JPS58122759A (ja) | 1982-01-14 | 1982-01-14 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP442282A JPS58122759A (ja) | 1982-01-14 | 1982-01-14 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58122759A true JPS58122759A (ja) | 1983-07-21 |
JPH044753B2 JPH044753B2 (enrdf_load_stackoverflow) | 1992-01-29 |
Family
ID=11583827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP442282A Granted JPS58122759A (ja) | 1982-01-14 | 1982-01-14 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58122759A (enrdf_load_stackoverflow) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60121653U (ja) * | 1984-01-27 | 1985-08-16 | 株式会社東芝 | 半導体装置の外囲器 |
JPS60180852A (ja) * | 1984-02-28 | 1985-09-14 | Kyocera Corp | 熱印刷装置 |
JPS60163751U (ja) * | 1984-04-04 | 1985-10-30 | スタンレー電気株式会社 | 半導体装置 |
JPS61114564A (ja) * | 1984-11-09 | 1986-06-02 | Nec Corp | 静電破壊防止機構付きicパツケ−ジ |
JPS61195067U (enrdf_load_stackoverflow) * | 1985-05-24 | 1986-12-04 | ||
JPS6230356U (enrdf_load_stackoverflow) * | 1985-08-07 | 1987-02-24 | ||
FR2774810A1 (fr) * | 1998-02-10 | 1999-08-13 | St Microelectronics Sa | Boitier semi-conducteur blinde et procede pour sa fabrication |
US9070793B2 (en) | 2010-08-02 | 2015-06-30 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages having electromagnetic interference shielding and related methods |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4863657U (enrdf_load_stackoverflow) * | 1971-11-22 | 1973-08-13 | ||
JPS51138165A (en) * | 1975-05-23 | 1976-11-29 | Mitsubishi Electric Corp | Package stracture for thermal resistance and shield |
-
1982
- 1982-01-14 JP JP442282A patent/JPS58122759A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4863657U (enrdf_load_stackoverflow) * | 1971-11-22 | 1973-08-13 | ||
JPS51138165A (en) * | 1975-05-23 | 1976-11-29 | Mitsubishi Electric Corp | Package stracture for thermal resistance and shield |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60121653U (ja) * | 1984-01-27 | 1985-08-16 | 株式会社東芝 | 半導体装置の外囲器 |
JPS60180852A (ja) * | 1984-02-28 | 1985-09-14 | Kyocera Corp | 熱印刷装置 |
JPS60163751U (ja) * | 1984-04-04 | 1985-10-30 | スタンレー電気株式会社 | 半導体装置 |
JPS61114564A (ja) * | 1984-11-09 | 1986-06-02 | Nec Corp | 静電破壊防止機構付きicパツケ−ジ |
JPS61195067U (enrdf_load_stackoverflow) * | 1985-05-24 | 1986-12-04 | ||
JPS6230356U (enrdf_load_stackoverflow) * | 1985-08-07 | 1987-02-24 | ||
FR2774810A1 (fr) * | 1998-02-10 | 1999-08-13 | St Microelectronics Sa | Boitier semi-conducteur blinde et procede pour sa fabrication |
US6312975B1 (en) | 1998-02-10 | 2001-11-06 | Stmicroelectronics S.A. | Semiconductor package and method of manufacturing the same |
US9070793B2 (en) | 2010-08-02 | 2015-06-30 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages having electromagnetic interference shielding and related methods |
Also Published As
Publication number | Publication date |
---|---|
JPH044753B2 (enrdf_load_stackoverflow) | 1992-01-29 |
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