JPS58122753A - 高密度チツプキヤリア - Google Patents

高密度チツプキヤリア

Info

Publication number
JPS58122753A
JPS58122753A JP57003406A JP340682A JPS58122753A JP S58122753 A JPS58122753 A JP S58122753A JP 57003406 A JP57003406 A JP 57003406A JP 340682 A JP340682 A JP 340682A JP S58122753 A JPS58122753 A JP S58122753A
Authority
JP
Japan
Prior art keywords
chip
cover
substrate
ceramic
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57003406A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6318860B2 (enrdf_load_stackoverflow
Inventor
Toshihiko Watari
渡里　俊彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57003406A priority Critical patent/JPS58122753A/ja
Publication of JPS58122753A publication Critical patent/JPS58122753A/ja
Publication of JPS6318860B2 publication Critical patent/JPS6318860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57003406A 1982-01-14 1982-01-14 高密度チツプキヤリア Granted JPS58122753A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57003406A JPS58122753A (ja) 1982-01-14 1982-01-14 高密度チツプキヤリア

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57003406A JPS58122753A (ja) 1982-01-14 1982-01-14 高密度チツプキヤリア

Publications (2)

Publication Number Publication Date
JPS58122753A true JPS58122753A (ja) 1983-07-21
JPS6318860B2 JPS6318860B2 (enrdf_load_stackoverflow) 1988-04-20

Family

ID=11556498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57003406A Granted JPS58122753A (ja) 1982-01-14 1982-01-14 高密度チツプキヤリア

Country Status (1)

Country Link
JP (1) JPS58122753A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63315361A (ja) * 1987-06-17 1988-12-23 Mitsubishi Electric Corp 電気車用ブレ−キ制御装置
JPS645044A (en) * 1987-06-26 1989-01-10 Nec Corp Semiconductor integrated circuit device
FR2647962A1 (fr) * 1989-05-30 1990-12-07 Thomson Composants Militaires Circuit electronique en boitier avec puce sur zone quadrillee de plots conducteurs
JPH0982841A (ja) * 1995-07-05 1997-03-28 Anam Ind Co Inc 熱放出特性及び脱湿性を向上させたボールグリッドアレイ半導体パッケージ
US7091060B2 (en) 1999-11-23 2006-08-15 Micron Technology, Inc. Circuit and substrate encapsulation methods
US7399657B2 (en) * 2000-08-31 2008-07-15 Micron Technology, Inc. Ball grid array packages with thermally conductive containers

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945729U (enrdf_load_stackoverflow) * 1972-08-02 1974-04-22
JPS5688343A (en) * 1979-12-21 1981-07-17 Fujitsu Ltd Multichip type semiconductor package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945729U (enrdf_load_stackoverflow) * 1972-08-02 1974-04-22
JPS5688343A (en) * 1979-12-21 1981-07-17 Fujitsu Ltd Multichip type semiconductor package

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63315361A (ja) * 1987-06-17 1988-12-23 Mitsubishi Electric Corp 電気車用ブレ−キ制御装置
JPS645044A (en) * 1987-06-26 1989-01-10 Nec Corp Semiconductor integrated circuit device
FR2647962A1 (fr) * 1989-05-30 1990-12-07 Thomson Composants Militaires Circuit electronique en boitier avec puce sur zone quadrillee de plots conducteurs
JPH0982841A (ja) * 1995-07-05 1997-03-28 Anam Ind Co Inc 熱放出特性及び脱湿性を向上させたボールグリッドアレイ半導体パッケージ
US7091060B2 (en) 1999-11-23 2006-08-15 Micron Technology, Inc. Circuit and substrate encapsulation methods
US7144245B2 (en) 1999-11-23 2006-12-05 Micron Technology, Inc. Packages for semiconductor die
US7239029B2 (en) 1999-11-23 2007-07-03 Micron Technology, Inc. Packages for semiconductor die
US7399657B2 (en) * 2000-08-31 2008-07-15 Micron Technology, Inc. Ball grid array packages with thermally conductive containers

Also Published As

Publication number Publication date
JPS6318860B2 (enrdf_load_stackoverflow) 1988-04-20

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