JPS58118738U - 半導体片ろう付け治具 - Google Patents

半導体片ろう付け治具

Info

Publication number
JPS58118738U
JPS58118738U JP1481482U JP1481482U JPS58118738U JP S58118738 U JPS58118738 U JP S58118738U JP 1481482 U JP1481482 U JP 1481482U JP 1481482 U JP1481482 U JP 1481482U JP S58118738 U JPS58118738 U JP S58118738U
Authority
JP
Japan
Prior art keywords
semiconductor piece
brazing jig
semiconductor
jig
piece brazing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1481482U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0219964Y2 (enExample
Inventor
進 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1481482U priority Critical patent/JPS58118738U/ja
Publication of JPS58118738U publication Critical patent/JPS58118738U/ja
Application granted granted Critical
Publication of JPH0219964Y2 publication Critical patent/JPH0219964Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP1481482U 1982-02-05 1982-02-05 半導体片ろう付け治具 Granted JPS58118738U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1481482U JPS58118738U (ja) 1982-02-05 1982-02-05 半導体片ろう付け治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1481482U JPS58118738U (ja) 1982-02-05 1982-02-05 半導体片ろう付け治具

Publications (2)

Publication Number Publication Date
JPS58118738U true JPS58118738U (ja) 1983-08-13
JPH0219964Y2 JPH0219964Y2 (enExample) 1990-05-31

Family

ID=30027268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1481482U Granted JPS58118738U (ja) 1982-02-05 1982-02-05 半導体片ろう付け治具

Country Status (1)

Country Link
JP (1) JPS58118738U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021009806A1 (ja) * 2019-07-12 2021-01-21 三菱電機株式会社 ろう付け用治具、および、それを用いて作製された積層型冷媒分配器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5547800U (enExample) * 1978-09-25 1980-03-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5547800U (enExample) * 1978-09-25 1980-03-28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021009806A1 (ja) * 2019-07-12 2021-01-21 三菱電機株式会社 ろう付け用治具、および、それを用いて作製された積層型冷媒分配器

Also Published As

Publication number Publication date
JPH0219964Y2 (enExample) 1990-05-31

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