JPS58118738U - Semiconductor piece brazing jig - Google Patents
Semiconductor piece brazing jigInfo
- Publication number
- JPS58118738U JPS58118738U JP1481482U JP1481482U JPS58118738U JP S58118738 U JPS58118738 U JP S58118738U JP 1481482 U JP1481482 U JP 1481482U JP 1481482 U JP1481482 U JP 1481482U JP S58118738 U JPS58118738 U JP S58118738U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor piece
- brazing jig
- semiconductor
- jig
- piece brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はリードフレー、ム形素子の製造に用いられる連
結された金属フレームの平面図、第２図はその半導体片
ろう行状態を示す第１図のＡ−Ａ線断面図、第３図は従
来のろう付は治具の一例の部分的はろう付は時の半はろ
う付時の半導体片の位置ずれを示す断面図、第５図は本
考案によるろう付は治具の一実施例の部分的断面図であ
る。
１：金属フレーム、３：半導体素子チップ、４：はんだ
、６：下側治具、７：上側個別治具、８：金属板。Fig. 1 is a plan view of a connected metal frame used for manufacturing a lead frame and a square element, Fig. 2 is a sectional view taken along the line A-A of Fig. 1 showing the soldering state of semiconductor pieces, and Fig. 3. 5 is a cross-sectional view of an example of a conventional brazing jig, and a partial cross-sectional view showing misalignment of a semiconductor piece during brazing. FIG. 5 is an example of a brazing jig according to the present invention. FIG. 3 is a partial cross-sectional view of an example. 1: metal frame, 3: semiconductor element chip, 4: solder, 6: lower jig, 7: upper individual jig, 8: metal plate.
Claims (1)
片をろう付するために用いられ、金属フレームを収容す
る下側部分と半導体片を収容する上側部分よりなるもの
Ｖこおいて、下側部分は一体として形成され、上側部分
は複数に分割され金属体によって相互に連結されたこと
を特徴とする半導体片ろう付は治具。It is used to braze a semiconductor piece to each of a plurality of connected metal frames, and consists of a lower part accommodating the metal frame and an upper part accommodating the semiconductor piece. A jig for brazing semiconductor pieces, which is formed as a single piece, and the upper part is divided into a plurality of parts and interconnected by metal bodies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1481482U JPS58118738U (en) | 1982-02-05 | 1982-02-05 | Semiconductor piece brazing jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1481482U JPS58118738U (en) | 1982-02-05 | 1982-02-05 | Semiconductor piece brazing jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58118738U true JPS58118738U (en) | 1983-08-13 |
| JPH0219964Y2 JPH0219964Y2 (en) | 1990-05-31 |
Family
ID=30027268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1481482U Granted JPS58118738U (en) | 1982-02-05 | 1982-02-05 | Semiconductor piece brazing jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58118738U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021009806A1 (en) * | 2019-07-12 | 2021-01-21 | 三菱電機株式会社 | Brazing jig and multilayer refrigerant distributor produced using same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5547800U (en) * | 1978-09-25 | 1980-03-28 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52104224A (en) * | 1976-02-27 | 1977-09-01 | Pioneer Electronic Corp | Method of producing acoustic transducer vibrator |
-
1982
- 1982-02-05 JP JP1481482U patent/JPS58118738U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5547800U (en) * | 1978-09-25 | 1980-03-28 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021009806A1 (en) * | 2019-07-12 | 2021-01-21 | 三菱電機株式会社 | Brazing jig and multilayer refrigerant distributor produced using same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0219964Y2 (en) | 1990-05-31 |
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