JPS58106849A - 低寄生容量半導体装置 - Google Patents

低寄生容量半導体装置

Info

Publication number
JPS58106849A
JPS58106849A JP57213441A JP21344182A JPS58106849A JP S58106849 A JPS58106849 A JP S58106849A JP 57213441 A JP57213441 A JP 57213441A JP 21344182 A JP21344182 A JP 21344182A JP S58106849 A JPS58106849 A JP S58106849A
Authority
JP
Japan
Prior art keywords
semiconductor device
substrate
semiconductor
layer
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57213441A
Other languages
English (en)
Japanese (ja)
Inventor
レイモンド・ヘンリ−
ジ−ン・ヴイクト−ル・ボウベツト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of JPS58106849A publication Critical patent/JPS58106849A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/4822—Beam leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/62—Capacitors having potential barriers
    • H10D1/64—Variable-capacitance diodes, e.g. varactors 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/60—Schottky-barrier diodes 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12032—Schottky diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP57213441A 1981-12-09 1982-12-07 低寄生容量半導体装置 Pending JPS58106849A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8123028 1981-12-09
FR8123028A FR2517883A1 (fr) 1981-12-09 1981-12-09 Dispositif semi-conducteur a faible capacite parasite muni de connexions externes prises au moyen de poutres

Publications (1)

Publication Number Publication Date
JPS58106849A true JPS58106849A (ja) 1983-06-25

Family

ID=9264840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57213441A Pending JPS58106849A (ja) 1981-12-09 1982-12-07 低寄生容量半導体装置

Country Status (4)

Country Link
EP (1) EP0081414B1 (enExample)
JP (1) JPS58106849A (enExample)
DE (1) DE3266962D1 (enExample)
FR (1) FR2517883A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63142820A (ja) * 1986-12-05 1988-06-15 Nec Corp 砒化ガリウム・デバイス・チツプ

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2540290A1 (fr) * 1983-01-28 1984-08-03 Thomson Csf Diode hyperfrequence a faible capacite parasite, et procede de realisation d'une telle diode
FR2604828B1 (fr) * 1986-10-06 1988-12-23 Centre Nat Rech Scient Procede de fabrication d'une diode p+nn+ et d'un transistor bipolaire comportant cette diode, utilisant l'effet de neutralisation des atomes donneurs par l'hydrogene atomique
US5378939A (en) * 1987-10-06 1995-01-03 The Board Of Trustees Of The Leland Stanford Junior University Gallium arsenide monolithically integrated sampling head using equivalent time sampling having a bandwidth greater than 100 Ghz
US5014018A (en) * 1987-10-06 1991-05-07 Stanford University Nonlinear transmission line for generation of picosecond electrical transients
FR2633454B1 (fr) * 1988-06-24 1992-01-17 Thomson Hybrides Microondes Dispositif d'accrochage de poutre sur un composant semiconducteur et son procede de fabrication
US7417266B1 (en) 2004-06-10 2008-08-26 Qspeed Semiconductor Inc. MOSFET having a JFET embedded as a body diode
US7436039B2 (en) 2005-01-06 2008-10-14 Velox Semiconductor Corporation Gallium nitride semiconductor device
US8026568B2 (en) 2005-11-15 2011-09-27 Velox Semiconductor Corporation Second Schottky contact metal layer to improve GaN Schottky diode performance
US7939853B2 (en) 2007-03-20 2011-05-10 Power Integrations, Inc. Termination and contact structures for a high voltage GaN-based heterojunction transistor
US8633094B2 (en) 2011-12-01 2014-01-21 Power Integrations, Inc. GaN high voltage HFET with passivation plus gate dielectric multilayer structure
US8940620B2 (en) 2011-12-15 2015-01-27 Power Integrations, Inc. Composite wafer for fabrication of semiconductor devices
US8928037B2 (en) 2013-02-28 2015-01-06 Power Integrations, Inc. Heterostructure power transistor with AlSiN passivation layer
US11469333B1 (en) 2020-02-19 2022-10-11 Semiq Incorporated Counter-doped silicon carbide Schottky barrier diode

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4097890A (en) * 1976-06-23 1978-06-27 Hewlett-Packard Company Low parasitic capacitance and resistance beamlead semiconductor component and method of manufacture
GB2067354B (en) * 1980-01-09 1984-04-18 Aei Semiconductors Ltd Mounting for a sc device
US4301233A (en) * 1980-05-29 1981-11-17 Eaton Corporation Beam lead Schottky barrier diode for operation at millimeter and submillimeter wave frequencies

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63142820A (ja) * 1986-12-05 1988-06-15 Nec Corp 砒化ガリウム・デバイス・チツプ

Also Published As

Publication number Publication date
EP0081414B1 (fr) 1985-10-16
DE3266962D1 (en) 1985-11-21
FR2517883A1 (fr) 1983-06-10
FR2517883B1 (enExample) 1985-05-17
EP0081414A1 (fr) 1983-06-15

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