DE3266962D1 - Semiconductor device having a low parasitive capacitance with beam-lead-type external connectors - Google Patents
Semiconductor device having a low parasitive capacitance with beam-lead-type external connectorsInfo
- Publication number
- DE3266962D1 DE3266962D1 DE8282402161T DE3266962T DE3266962D1 DE 3266962 D1 DE3266962 D1 DE 3266962D1 DE 8282402161 T DE8282402161 T DE 8282402161T DE 3266962 T DE3266962 T DE 3266962T DE 3266962 D1 DE3266962 D1 DE 3266962D1
- Authority
- DE
- Germany
- Prior art keywords
- parasitive
- capacitance
- lead
- semiconductor device
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
- H01L23/4822—Beam leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/62—Capacitors having potential barriers
- H10D1/64—Variable-capacitance diodes, e.g. varactors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/60—Schottky-barrier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8123028A FR2517883A1 (fr) | 1981-12-09 | 1981-12-09 | Dispositif semi-conducteur a faible capacite parasite muni de connexions externes prises au moyen de poutres |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3266962D1 true DE3266962D1 (en) | 1985-11-21 |
Family
ID=9264840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE8282402161T Expired DE3266962D1 (en) | 1981-12-09 | 1982-11-26 | Semiconductor device having a low parasitive capacitance with beam-lead-type external connectors |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0081414B1 (enExample) |
| JP (1) | JPS58106849A (enExample) |
| DE (1) | DE3266962D1 (enExample) |
| FR (1) | FR2517883A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2540290A1 (fr) * | 1983-01-28 | 1984-08-03 | Thomson Csf | Diode hyperfrequence a faible capacite parasite, et procede de realisation d'une telle diode |
| FR2604828B1 (fr) * | 1986-10-06 | 1988-12-23 | Centre Nat Rech Scient | Procede de fabrication d'une diode p+nn+ et d'un transistor bipolaire comportant cette diode, utilisant l'effet de neutralisation des atomes donneurs par l'hydrogene atomique |
| JPS63142820A (ja) * | 1986-12-05 | 1988-06-15 | Nec Corp | 砒化ガリウム・デバイス・チツプ |
| US5378939A (en) * | 1987-10-06 | 1995-01-03 | The Board Of Trustees Of The Leland Stanford Junior University | Gallium arsenide monolithically integrated sampling head using equivalent time sampling having a bandwidth greater than 100 Ghz |
| US5014018A (en) * | 1987-10-06 | 1991-05-07 | Stanford University | Nonlinear transmission line for generation of picosecond electrical transients |
| FR2633454B1 (fr) * | 1988-06-24 | 1992-01-17 | Thomson Hybrides Microondes | Dispositif d'accrochage de poutre sur un composant semiconducteur et son procede de fabrication |
| US7417266B1 (en) | 2004-06-10 | 2008-08-26 | Qspeed Semiconductor Inc. | MOSFET having a JFET embedded as a body diode |
| US7436039B2 (en) | 2005-01-06 | 2008-10-14 | Velox Semiconductor Corporation | Gallium nitride semiconductor device |
| US8026568B2 (en) | 2005-11-15 | 2011-09-27 | Velox Semiconductor Corporation | Second Schottky contact metal layer to improve GaN Schottky diode performance |
| US7939853B2 (en) | 2007-03-20 | 2011-05-10 | Power Integrations, Inc. | Termination and contact structures for a high voltage GaN-based heterojunction transistor |
| US8633094B2 (en) | 2011-12-01 | 2014-01-21 | Power Integrations, Inc. | GaN high voltage HFET with passivation plus gate dielectric multilayer structure |
| US8940620B2 (en) | 2011-12-15 | 2015-01-27 | Power Integrations, Inc. | Composite wafer for fabrication of semiconductor devices |
| US8928037B2 (en) | 2013-02-28 | 2015-01-06 | Power Integrations, Inc. | Heterostructure power transistor with AlSiN passivation layer |
| US11469333B1 (en) | 2020-02-19 | 2022-10-11 | Semiq Incorporated | Counter-doped silicon carbide Schottky barrier diode |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4097890A (en) * | 1976-06-23 | 1978-06-27 | Hewlett-Packard Company | Low parasitic capacitance and resistance beamlead semiconductor component and method of manufacture |
| GB2067354B (en) * | 1980-01-09 | 1984-04-18 | Aei Semiconductors Ltd | Mounting for a sc device |
| US4301233A (en) * | 1980-05-29 | 1981-11-17 | Eaton Corporation | Beam lead Schottky barrier diode for operation at millimeter and submillimeter wave frequencies |
-
1981
- 1981-12-09 FR FR8123028A patent/FR2517883A1/fr active Granted
-
1982
- 1982-11-26 DE DE8282402161T patent/DE3266962D1/de not_active Expired
- 1982-11-26 EP EP82402161A patent/EP0081414B1/fr not_active Expired
- 1982-12-07 JP JP57213441A patent/JPS58106849A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0081414B1 (fr) | 1985-10-16 |
| FR2517883A1 (fr) | 1983-06-10 |
| FR2517883B1 (enExample) | 1985-05-17 |
| JPS58106849A (ja) | 1983-06-25 |
| EP0081414A1 (fr) | 1983-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |