JPS5810385Y2 - ２層配線回路 - Google Patents

２層配線回路

Info

Publication number
JPS5810385Y2
JPS5810385Y2 JP1978170404U JP17040478U JPS5810385Y2 JP S5810385 Y2 JPS5810385 Y2 JP S5810385Y2 JP 1978170404 U JP1978170404 U JP 1978170404U JP 17040478 U JP17040478 U JP 17040478U JP S5810385 Y2 JPS5810385 Y2 JP S5810385Y2
Authority
JP
Japan
Prior art keywords
conductors
group
layer wiring
wiring circuit
thermal head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1978170404U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5588270U (de
Inventor
進 柴田
Original Assignee
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沖電気工業株式会社 filed Critical 沖電気工業株式会社
Priority to JP1978170404U priority Critical patent/JPS5810385Y2/ja
Publication of JPS5588270U publication Critical patent/JPS5588270U/ja
Application granted granted Critical
Publication of JPS5810385Y2 publication Critical patent/JPS5810385Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Facsimile Heads (AREA)
  • Wire Bonding (AREA)
  • Electronic Switches (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP1978170404U 1978-12-13 1978-12-13 ２層配線回路 Expired JPS5810385Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978170404U JPS5810385Y2 (ja) 1978-12-13 1978-12-13 ２層配線回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978170404U JPS5810385Y2 (ja) 1978-12-13 1978-12-13 ２層配線回路

Publications (2)

Publication Number Publication Date
JPS5588270U JPS5588270U (de) 1980-06-18
JPS5810385Y2 true JPS5810385Y2 (ja) 1983-02-25

Family

ID=29173367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978170404U Expired JPS5810385Y2 (ja) 1978-12-13 1978-12-13 ２層配線回路

Country Status (1)

Country Link
JP (1) JPS5810385Y2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57123071A (en) * 1981-01-22 1982-07-31 Matsushita Electric Ind Co Ltd Heat-sensitive recording head

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5426746A (en) * 1977-07-30 1979-02-28 Toshiba Corp Heat-sensitive recording head

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5426746A (en) * 1977-07-30 1979-02-28 Toshiba Corp Heat-sensitive recording head

Also Published As

Publication number Publication date
JPS5588270U (de) 1980-06-18

Similar Documents

Publication Publication Date Title
KR100604821B1 (ko) 적층형 볼 그리드 어레이 패키지 및 그 제조방법
EP0318209B1 (de) Verbindungstechnik mit dielektrischen Schichten
JP2002543618A (ja) 積重ね可能なフレックス回路用ｉｃパッケージ及びその製造方法
JPS62126661A (ja) 混成集積回路装置
JPH06244360A (ja) 半導体装置
JP2727862B2 (ja) 接続テープおよびフィルムキャリア型ｉｃならびに接続方法
JPS5810385Y2 (ja) ２層配線回路
JPH0831868A (ja) Ｂｇａ型半導体装置
JPS63142663A (ja) 半導体装置とその製造方法
EP0448713A4 (de) Halbleiteranordnung.
JPH037973Y2 (de)
JPH0286159A (ja) 半導体装置
JPH06342874A (ja) 高集積半導体装置
JPH0719165Y2 (ja) マルチチップ構造
JPH10270491A (ja) 半導体装置およびその製造方法
JPH0778934A (ja) 半導体装置およびその製造方法
JP2836208B2 (ja) フィルムキャリアテープ
JPH06140461A (ja) 半導体チップの実装方法および実装構造体
JPH0634437B2 (ja) 基板接続構造
JPH0617285Y2 (ja) 半導体装置
JPH0524993Y2 (de)
JPS62195138A (ja) 積層半導体装置
JPH04154157A (ja) 半導体装置の製造方法
JPH01191434A (ja) Ｔａｂ実装方法
JPS615537A (ja) 半導体装置