JPS5790072A - Resist ink composition for chemical plating - Google Patents
Resist ink composition for chemical platingInfo
- Publication number
- JPS5790072A JPS5790072A JP55164598A JP16459880A JPS5790072A JP S5790072 A JPS5790072 A JP S5790072A JP 55164598 A JP55164598 A JP 55164598A JP 16459880 A JP16459880 A JP 16459880A JP S5790072 A JPS5790072 A JP S5790072A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resist ink
- hardener
- chemical plating
- arom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 3
- 239000000126 substance Substances 0.000 title abstract 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 6
- 239000003822 epoxy resin Substances 0.000 abstract 5
- 229920000647 polyepoxide Polymers 0.000 abstract 5
- 239000004848 polyfunctional curative Substances 0.000 abstract 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 150000001412 amines Chemical class 0.000 abstract 2
- 239000002904 solvent Substances 0.000 abstract 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 abstract 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 229940018564 m-phenylenediamine Drugs 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 239000000454 talc Substances 0.000 abstract 1
- 229910052623 talc Inorganic materials 0.000 abstract 1
- 239000013008 thixotropic agent Substances 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55164598A JPS5790072A (en) | 1980-11-25 | 1980-11-25 | Resist ink composition for chemical plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55164598A JPS5790072A (en) | 1980-11-25 | 1980-11-25 | Resist ink composition for chemical plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5790072A true JPS5790072A (en) | 1982-06-04 |
| JPH0125790B2 JPH0125790B2 (enrdf_load_stackoverflow) | 1989-05-19 |
Family
ID=15796214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55164598A Granted JPS5790072A (en) | 1980-11-25 | 1980-11-25 | Resist ink composition for chemical plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5790072A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59155994A (ja) * | 1983-02-25 | 1984-09-05 | 株式会社日立製作所 | 多層印刷配線板の製造方法 |
| JPS6026669A (ja) * | 1983-07-25 | 1985-02-09 | Hitachi Condenser Co Ltd | 無電解めつき用レジストインク |
| JPS6082673A (ja) * | 1983-10-14 | 1985-05-10 | Hitachi Ltd | 耐めつき性ソルダレジストインク組成物 |
| JPS6123666A (ja) * | 1984-07-13 | 1986-02-01 | Hitachi Ltd | 耐めつきソルダレジストインク組成物 |
| JPH05188593A (ja) * | 1991-07-15 | 1993-07-30 | Internatl Business Mach Corp <Ibm> | フォトイメージング用の改良された組成物 |
| JPH06317905A (ja) * | 1993-11-15 | 1994-11-15 | Ibiden Co Ltd | 感光性樹脂組成物及びプリント配線板 |
| US6010823A (en) * | 1996-03-13 | 2000-01-04 | Ibiden Co., Ltd. | Resist compositions for plating |
| US6217987B1 (en) | 1996-11-20 | 2001-04-17 | Ibiden Co. Ltd. | Solder resist composition and printed circuit boards |
-
1980
- 1980-11-25 JP JP55164598A patent/JPS5790072A/ja active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59155994A (ja) * | 1983-02-25 | 1984-09-05 | 株式会社日立製作所 | 多層印刷配線板の製造方法 |
| JPS6026669A (ja) * | 1983-07-25 | 1985-02-09 | Hitachi Condenser Co Ltd | 無電解めつき用レジストインク |
| JPS6082673A (ja) * | 1983-10-14 | 1985-05-10 | Hitachi Ltd | 耐めつき性ソルダレジストインク組成物 |
| JPS6123666A (ja) * | 1984-07-13 | 1986-02-01 | Hitachi Ltd | 耐めつきソルダレジストインク組成物 |
| JPH05188593A (ja) * | 1991-07-15 | 1993-07-30 | Internatl Business Mach Corp <Ibm> | フォトイメージング用の改良された組成物 |
| JPH06317905A (ja) * | 1993-11-15 | 1994-11-15 | Ibiden Co Ltd | 感光性樹脂組成物及びプリント配線板 |
| US6010823A (en) * | 1996-03-13 | 2000-01-04 | Ibiden Co., Ltd. | Resist compositions for plating |
| US6217987B1 (en) | 1996-11-20 | 2001-04-17 | Ibiden Co. Ltd. | Solder resist composition and printed circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0125790B2 (enrdf_load_stackoverflow) | 1989-05-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS57185316A (en) | Electrically conductive resin paste | |
| MY101959A (en) | Solventless, polyimide- modified epoxy composition | |
| DE69531500D1 (de) | Epoxidharzgiessmasse | |
| JPS5790072A (en) | Resist ink composition for chemical plating | |
| JPS55165916A (en) | Epoxy resin composition | |
| JPS56157471A (en) | Resist ink composition for chemical plating | |
| JPS5679170A (en) | Adhesive composition | |
| JPS57180626A (en) | Thermosetting resin composition | |
| JPS6330578A (ja) | エポキシ樹脂系レジストインク組成物 | |
| JPS6249293B2 (enrdf_load_stackoverflow) | ||
| JPS56109261A (en) | Expansion type rust-inhibiting material | |
| JPS5693776A (en) | Ultraviolet curing type printing ink composition | |
| JPS5278934A (en) | Adhesive composition for chemical plating | |
| JPS536400A (en) | Curable epoxy resin compositions | |
| JPS56143223A (en) | Bonding method of polyolefin to metal | |
| JPS6251971B2 (enrdf_load_stackoverflow) | ||
| JPS5725322A (en) | Epoxy resin composition | |
| JPS51135999A (en) | Epoxy res in composition | |
| JPS5589367A (en) | Rust preventive material | |
| JPS57168963A (en) | Corrosion-resistant coating composition | |
| RU2043668C1 (ru) | Электроизоляционная композиция | |
| JPS5513754A (en) | Curing agent for epoxy resin | |
| JPS57162764A (en) | Preparation of chemically platable powder coating | |
| JPS57187325A (en) | Production of epoxy resin laminated sheet | |
| JPS575717A (en) | Resin composition for laminatings |